Inventor · disambiguated record
Keisuke Ookubo
Also filed as: OOKUBO KEISUKE
6 granted patents·5 pending applications·24 citations·filing 1998–2011
79Inventor score
Top patents by PatentIndex Score
11 records- 0185US7578891B2Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 25, 2009·11 cites·10 claims
- 0275US8200059B2Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of themSHIBATA TOMOAKI·Filed 2008·Granted Jun 12, 2012·2 cites·29 claims
- 0365US8003207B2Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Aug 23, 2011·2 cites·5 claims
- 0458US9431314B2Thermosetting resin composition for sealing packing of semiconductor, and semiconductor deviceENOMOTO TETSUYA·Filed 2011·Granted Aug 30, 2016·2 cites·7 claims
- 0554US8012580B2Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Sep 6, 2011·0 cites·5 claims
- 0648US2011281399A1Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor deviceOOKUBO KEISUKE·Filed 2011·Application pending·0 cites
- 0746US2012048332A1Adhesive film for solar cell electrode and method for manufacturing solar cell module using the sameSHIMIZU SHIGENORI·Filed 2011·Application pending·0 cites
- 0843US6369509B1Short arc lamp with crack-preventing electric mounting arrangementUSHIO ELECTRIC INC·Filed 1998·Granted Apr 9, 2002·7 cites·10 claims
- 0942US2011193244A1Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor deviceMASUKO TAKASHI·Filed 2011·Application pending·0 cites
- 1039US2007098995A1Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 1136US2011241228A1Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →