Inventor · disambiguated record
Michel Koopmans
Also filed as: KOOPMANS MICHEL
33 granted patents·3 pending applications·657 citations·filing 2001–2025
97Inventor score
Top patents by PatentIndex Score
36 records- 0198US6706557B2Method of fabricating stacked die configurations utilizing redistribution bond padsMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 16, 2004·168 cites·49 claims
- 0297US10461059B2Stacked semiconductor die assemblies with improved thermal performance and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 29, 2019·22 cites·20 claims
- 0397US6847105B2Bumping technology in stacked die configurationsMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 25, 2005·157 cites·57 claims
- 0496US8937309B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Jan 20, 2015·48 cites·13 claims
- 0596US8552567B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Oct 8, 2013·36 cites·22 claims
- 0695US9379091B2Semiconductor die assemblies and semiconductor devices including sameMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 28, 2016·15 cites·22 claims
- 0795US9287240B2Stacked semiconductor die assemblies with thermal spacers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 15, 2016·21 cites·21 claims
- 0895US6589809B1Method for attaching semiconductor components to a substrate using local UV curing of dicing tapeMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 8, 2003·76 cites·28 claims
- 0993US9659917B1Apparatuses and methods for forming die stacksMICRON TECHNOLOGY INC·Filed 2015·Granted May 23, 2017·6 cites·32 claims
- 1091US9881910B2Apparatuses and methods for forming die stacksMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 30, 2018·4 cites·20 claims
- 1190US9711494B2Methods of fabricating semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 18, 2017·7 cites·16 claims
- 1289US9733304B2Semiconductor device test apparatusesMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 15, 2017·5 cites·19 claims
- 1387US9269700B2Stacked semiconductor die assemblies with improved thermal performance and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 23, 2016·7 cites·21 claims
- 1486US9768147B2Thermal pads between stacked semiconductor dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 19, 2017·5 cites·11 claims
- 1586US2024347511A1Thermal pads between stacked semiconductor dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1684US9362143B2Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packagesSUN YANGYANG·Filed 2012·Granted Jun 7, 2016·12 cites·26 claims
- 1782US8828798B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 9, 2014·4 cites·18 claims
- 1881US6911624B2Component installation, removal, and replacement apparatus and methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 28, 2005·26 cites·56 claims
- 1980US10481200B2Semiconductor device test apparatuses comprising at least one test site having an array of pocketsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 19, 2019·1 cites·18 claims
- 2078US10126357B2Methods of testing semiconductor devices comprising a die stack having protruding conductive elementsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·1 cites·20 claims
- 2178US10062679B2Apparatuses and methods for forming die stacksMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·1 cites·20 claims
- 2275US10153027B1Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 11, 2018·1 cites·12 claims
- 2375US10083734B1Memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 25, 2018·1 cites·14 claims
- 2475US6845901B2Apparatus and method for depositing and reflowing solder paste on a microelectronic workpieceMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 25, 2005·13 cites·58 claims
- 2574US6943094B2Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 13, 2005·12 cites·21 claims
- 2672US12033980B2Thermal pads between stacked semiconductor dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 9, 2024·0 cites·20 claims
- 2767US10242726B1Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 26, 2019·1 cites·22 claims
- 2867US9818625B2Stacked semiconductor die assemblies with thermal spacers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·1 cites·18 claims
- 2964US10269782B2Apparatuses and methods for forming die stacksMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 23, 2019·0 cites·20 claims
- 3063US7637412B2Apparatus and method for depositing and reflowing solder paste on a microelectronic workpieceMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 29, 2009·1 cites·14 claims
- 3161US10651155B2Thermal pads between stacked semiconductor dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 12, 2020·0 cites·23 claims
- 3260US7347348B2Apparatus and method for depositing and reflowing solder paste on a microelectronic workpieceMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 25, 2008·5 cites·3 claims
- 3359US10096579B2Thermal pads between stacked semiconductor dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 9, 2018·0 cites·17 claims
- 3454US11004494B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2019·Granted May 11, 2021·0 cites·15 claims
- 3551US2006130974A1System for attaching semiconductor components to substratesKOOPMANS MICHEL·Filed 2006·Application pending·0 cites
- 3650US2025329676A1Microelectronic devices, and related methods and memory devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →