System for attaching semiconductor components to substrates

Abstract

A method and a system for attaching semiconductor components to a substrate are provided. In the illustrative embodiment the substrate is a leadframe, and the components are semiconductor dice or packages contained on a component substrate such as a wafer. The method includes the steps of holding and dicing the component substrate using a radiation sensitive tape. The method also includes the steps of providing a component attach system having a radiation curing system, and then performing local curing of the dicing tape during a component attach step using the component attach system. The system includes the component attach system which includes a stepper mechanism for stepping the component substrate, and a component attach mechanism having an ejector pin for pushing the components one at a time from the tape and a pick and place mechanism for placing the components on the substrate. The component attach mechanism also includes a housing having a contact surface for physically engaging the dicing tape, and an opening having an outline matching that of a singulated component.

1 . A system for attaching a semiconductor component to a substrate comprising: 
 a radiation sensitive tape configured to hold the component; and    a component attach system configured to attach the component to the substrate, the component attach system including a component attach mechanism configured to remove the component from the tape and to place the component on the substrate, a radiation exposure assembly on the component attach mechanism configured to expose the tape in an exposure area proximate to the component to a radiation, a stepper mechanism configured to align the component on the component attach mechanism and a controller configured to control the component attach mechanism, the stepper mechanism and the radiation exposure assembly.    
     
     
         2 . The system of  claim 1  wherein the component attach mechanism comprises a housing having a surface configured to physically engage the tape proximate to the exposure area, and an opening having an outline corresponding to that of the component for directing the radiation to define the exposure area.  
     
     
         3 . The system of  claim 1  wherein the radiation exposure assembly comprises a radiation source in the housing and a fiber optic cable in the housing in communication with the radiation source.  
     
     
         4 . The system of  claim 1  wherein the component attach system comprises a die attacher.  
     
     
         5 . The system of  claim 1  wherein the component attach system includes a vacuum pick and place mechanism configured to hold and place the component on the substrate.  
     
     
         6 . The system of  claim 1  wherein the component attach mechanism includes an opening having an outline corresponding to that of the component for directing the radiation to define the exposure area.  
     
     
         7 . The system of  claim 1  wherein the tape comprise a polymer substrate and at least one surface having an adhesive thereon.  
     
     
         8 . The system of  claim 1  wherein the tape comprises a polymer layer having adhesive qualities.  
     
     
         9 . A system for attaching semiconductor components to a substrate comprising: 
 a support member comprising a radiation sensitive tape configured to hold the components;    a component attach system configured to attach an adhesive to the substrate and a component to the adhesive, the component attach system including:    a component attach mechanism comprising a housing, a contact surface on the housing configured to physically engage the tape, an opening on the surface having an outline corresponding to that of the component, and a pin configured to move through the opening and to push the component from the tape;    a radiation exposure assembly on the housing configured to direct a radiation through the opening onto an area of the tape proximate to the component;    a stepper mechanism configured to align the component with the opening; and    a controller configured to control the component attach mechanism, the stepper mechanism and the radiation exposure assembly, to attach the adhesive to the substrate, to expose the area to the radiation, and to attach the component to the adhesive.    
     
     
         10 . The system of  claim 9  wherein the controller comprises a computer.  
     
     
         11 . The system of  claim 9  wherein the component attach system comprises a die attacher, the component comprises a die or a package, and the substrate comprises a leadframe.  
     
     
         12 . The system of  claim 9  wherein the radiation comprises infrared, thermal or radioactive radiation.  
     
     
         13 . The system of  claim 9  wherein the component attach mechanism comprises a vacuum opening on the surface in flow communication with a vacuum source configured to hold the tape on the surface.  
     
     
         14 . The system of  claim 9  wherein the radiation exposure assembly comprises a fiber optic cable and a lens configured to focus the radiation.  
     
     
         15 . A system for attaching semiconductor components to a substrate comprising: 
 a support member comprising a radiation sensitive tape configured to hold the components;    a component attach system comprising a die attacher configured to attach an adhesive to the substrate and a component to the adhesive, the die attacher including: 
 a component attach mechanism having a housing with a contact surface configured to contact the tape, an opening on the surface having an outline corresponding to that of the component, a pin configured to move through the opening and to push the component off the tape, and a pick and place mechanism configured to pick and place the component on the substrate;  
 a stepper mechanism configured to align the component with the opening; and  
 a radiation exposure assembly on the housing configured to direct a radiation through the opening onto an area of the tape proximate to the component.  
   
     
     
         16 . The system of  claim 15  wherein the component attach system comprises a controller configured to control the component attach mechanism and the radiation exposure assembly to attach the adhesive to the substrate, to expose the area to the radiation, and to attach the component to the adhesive.  
     
     
         17 . The system of  claim 15  wherein the radiation comprises ultraviolet, infrared, thermal or radioactive radiation.  
     
     
         18 . The system of  claim 15  wherein the support member comprises an open frame have the tape stretched there across.  
     
     
         19 . The system of  claim 15  wherein the components comprise dice or packages and the substrate comprises a leadframe.  
     
     
         20 . The system of  claim 15  wherein the radiation exposure assembly comprises a source of the radiation, a fiber optic cable in communication with the source, and a lens on the cable proximate to the opening.  
     
     
         21 . A system for attaching semiconductor components to a substrate comprising: 
 a radiation sensitive tape configured to hold the components;    a component attach system configured to attach a component to the substrate, the component attach system including:    a component attach mechanism comprising a housing having a surface with an opening, at least one pin configured to move through the opening to push the component from the tape and at least one vacuum opening on the surface proximate to the opening configured to hold the tape on the surface; and    a radiation exposure assembly comprising a source of a radiation and a fiber optic cable in communication with the source attached to the housing and configured to direct the radiation through the opening to expose a selected area of the tape proximate to the component to the radiation.    
     
     
         22 . The system of  claim 21  wherein the opening has an outline corresponding to that of the component.  
     
     
         23 . The system of  claim 21  wherein the component attach system comprises a die attacher.  
     
     
         24 . The system of  claim 21  wherein the component attach system comprises a controller configured to control the component attach mechanism and the radiation exposure assembly.