Inventor · disambiguated record
Luke England
Also filed as: ENGLAND LUKE · ENGLAND LUKE G
49 granted patents·12 pending applications·592 citations·filing 2007–2021
98Inventor score
Files withGLOBALFOUNDRIES INC27MICRON TECHNOLOGY INC13ENGLAND LUKE G4ENGLAND LUKE3APTINA IMAGING CORP2
Top patents by PatentIndex Score
61 records- 0198US10163864B1Vertically stacked wafers and methods of forming sameGLOBALFOUNDRIES INC·Filed 2017·Granted Dec 25, 2018·24 cites·14 claims
- 0296US10224286B1Interconnect structure with adhesive dielectric layer and methods of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 5, 2019·17 cites·12 claims
- 0396US9865570B1Integrated circuit package with thermally conductive pillarGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 9, 2018·25 cites·12 claims
- 0496US8937309B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Jan 20, 2015·48 cites·13 claims
- 0596US8552567B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Oct 8, 2013·36 cites·22 claims
- 0695US9536848B2Bond pad structure for low temperature flip chip bondingGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 3, 2017·219 cites·6 claims
- 0795US9379091B2Semiconductor die assemblies and semiconductor devices including sameMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 28, 2016·15 cites·22 claims
- 0894US10818570B1Stacked semiconductor devices having dissimilar-sized diesGLOBALFOUNDRIES INC·Filed 2019·Granted Oct 27, 2020·11 cites·20 claims
- 0994US7863096B2Embedded die package and process flow using a pre-molded carrierFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jan 4, 2011·31 cites·12 claims
- 1093US9553080B1Method and process for integration of TSV-middle in 3D IC stacksGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 24, 2017·12 cites·9 claims
- 1192US10388631B13D IC package with RDL interposer and related methodGLOBALFOUNDRIES INC·Filed 2018·Granted Aug 20, 2019·7 cites·8 claims
- 1292US9153520B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsGROOTHUIS STEVEN K·Filed 2012·Granted Oct 6, 2015·17 cites·21 claims
- 1392US8421168B2Microelectromechanical systems microphone packaging systemsALLEN HOWARD·Filed 2010·Granted Apr 16, 2013·43 cites·20 claims
- 1490US9711494B2Methods of fabricating semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 18, 2017·7 cites·16 claims
- 1588US8659153B2Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methodsFAY OWEN R·Filed 2012·Granted Feb 25, 2014·9 cites·29 claims
- 1688US8304896B2Embedded die package and process flow using a pre-molded carrierENGLAND LUKE·Filed 2010·Granted Nov 6, 2012·11 cites·10 claims
- 1787US9257383B2Method and device for an integrated trench capacitorGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 9, 2016·7 cites·11 claims
- 1886US9553058B1Wafer backside redistribution layer warpage controlGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 24, 2017·5 cites·16 claims
- 1984US9397073B1Method of using a back-end-of-line connection structure to distribute current envenly among multiple TSVs in a series for delivery to a top dieGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 19, 2016·5 cites·12 claims
- 2083US10170389B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 1, 2019·3 cites·16 claims
- 2182US8828798B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 9, 2014·4 cites·18 claims
- 2279US11037906B23D IC package with RDL interposer and related methodGLOBALFOUNDRIES US INC·Filed 2019·Granted Jun 15, 2021·2 cites·8 claims
- 2378US7919410B2Packaging methods for imager devicesAPTINA IMAGING CORP·Filed 2007·Granted Apr 5, 2011·8 cites·8 claims
- 2475US10770440B2Micro-LED display assemblyGLOBALFOUNDRIES INC·Filed 2017·Granted Sep 8, 2020·2 cites·20 claims
- 2575US10741468B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 11, 2020·1 cites·11 claims
- 2675US7622786B2EMI shielding for imager devicesAPTINA IMAGING CORP·Filed 2007·Granted Nov 24, 2009·6 cites·14 claims
- 2774US10083958B2Deep trench metal-insulator-metal capacitorsGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 25, 2018·2 cites·19 claims
- 2872US10283487B2Methods of forming integrated circuit package with thermally conductive pillarGLOBALFOUNDRIES INC·Filed 2017·Granted May 7, 2019·1 cites·18 claims
- 2971US11594462B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 28, 2023·0 cites·15 claims
- 3071US9129869B2Pillar on pad interconnect structures, semiconductor devices including same and related methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 8, 2015·2 cites·24 claims
- 3168US8304888B2Integrated circuit package with embedded componentsENGLAND LUKE·Filed 2009·Granted Nov 6, 2012·5 cites·20 claims
- 3267US10636776B2Methods of manufacturing RF filtersGLOBALFOUNDRIES INC·Filed 2018·Granted Apr 28, 2020·2 cites·12 claims
- 3367US9716487B1Latency compensation network using timing slack sensorsGLOBALFOUNDRIES INC·Filed 2016·Granted Jul 25, 2017·2 cites·20 claims
- 3464US9466659B2Fabrication of multilayer circuit elementsGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 11, 2016·1 cites·20 claims
- 3562US9613897B2Integrated circuits including magnetic core inductors and methods for fabricating the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Apr 4, 2017·1 cites·20 claims
- 3660US10741460B2Methods for forming interconnect assemblies with probed bond padsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 11, 2020·0 cites·17 claims
- 3759US10069490B2Method, apparatus and system for voltage compensation in a semiconductor waferGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 4, 2018·1 cites·18 claims
- 3857US10134647B2Methods for forming interconnect assemblies with probed bond padsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 20, 2018·0 cites·20 claims
- 3953US9646899B2Interconnect assemblies with probed bond padsFAY OWEN R·Filed 2012·Granted May 9, 2017·0 cites·30 claims
- 4052US11038011B2Metal-insulator-metal capacitors including nanofibersGLOBALFOUNDRIES US INC·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 4152US9590028B2Method and device for an integrated trench capacitorGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 7, 2017·0 cites·16 claims
- 4250US2014291834A1Semiconductor devices and packages including conductive underfill material and related methodsMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 4348US12199003B2Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structureMARVELL ASIA PTE LTD·Filed 2021·Granted Jan 14, 2025·0 cites·17 claims
- 4448US2016351530A1Semiconductor devices and packages including conductive underfill material and related methodsMICRON TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 4547US10090227B1Back biasing in SOI FET technologyGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 2, 2018·0 cites·20 claims
- 4646US10381304B2Interconnect structureGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 13, 2019·0 cites·20 claims
- 4746US10026883B2Wafer bond interconnect structuresGLOBALFOUNDRIES INC·Filed 2016·Granted Jul 17, 2018·0 cites·20 claims
- 4846US2009243051A1Integrated conductive shield for microelectronic device assemblies and associated methodsMICRON TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 4946US2010148337A1Stackable semiconductor package and process to manufacture sameLIU YONG·Filed 2008·Application pending·0 cites
- 5046US2009243012A1Electromagnetic interference shield structures for semiconductor componentsMICRON TECHNOLOGY INC·Filed 2008·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →