Assignee
ENGLAND LUKE
US·2 granted patents·1 pending application·16 citations·filing 2009–2010
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0188US8304896B2Embedded die package and process flow using a pre-molded carrierENGLAND LUKE·Filed 2010·Granted Nov 6, 2012·11 cites·10 claims
- 0268US8304888B2Integrated circuit package with embedded componentsENGLAND LUKE·Filed 2009·Granted Nov 6, 2012·5 cites·20 claims
- 0335US2011266670A1Wafer level chip scale package with annular reinforcement structureENGLAND LUKE·Filed 2010·Application pending·0 cites
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