Inventor · disambiguated record
Boyd Coomer
Also filed as: COOMER BOYD · COOMER BOYD L
6 granted patents·3 pending applications·27 citations·filing 2002–2004
78Inventor score
Files withINTEL CORP7
Top patents by PatentIndex Score
9 records- 0163US6974775B2Method and apparatus for making an imprinted conductive circuit using semi-additive platingINTEL CORP·Filed 2002·Granted Dec 13, 2005·14 cites·15 claims
- 0256US6899815B2Multi-layer integrated circuit packageINTEL CORP·Filed 2002·Granted May 31, 2005·7 cites·17 claims
- 0351US7637008B2Methods for manufacturing imprinted substratesINTEL CORP·Filed 2002·Granted Dec 29, 2009·4 cites·21 claims
- 0442US7358116B2Substrate conductive post formationINTEL CORP·Filed 2002·Granted Apr 15, 2008·1 cites·14 claims
- 0541US6777648B2Method and system to manufacture stacked chip devicesINTEL CORP·Filed 2002·Granted Aug 17, 2004·1 cites·17 claims
- 0640US7245001B2Multi-layer integrated circuit packageINTEL CORP·Filed 2004·Granted Jul 17, 2007·0 cites·11 claims
- 0737US2004222512A1Method and system to manufacture stacked chip devicesINTEL CORP·Filed 2004·Application pending·0 cites
- 0834US2005123860A1Dielectric with fluorescent materialFiled 2003·Application pending·0 cites
- 0933US2004126547A1Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefromFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →