Inventor · disambiguated record
Steven Kummerl
Also filed as: KUMMERL STEVEN · KUMMERL STEVEN A · KUMMERL STEVEN ALFRED
43 granted patents·25 pending applications·276 citations·filing 2004–2025
97Inventor score
Files withTEXAS INSTRUMENTS INC60KUMMERL STEVEN A2AMARO MICHAEL G1HOLLOWAY JEFFERY GAIL1KUMMERL STEVEN1
Top patents by PatentIndex Score
68 records- 0198US7578422B2Bond capillary design for ribbon wire bondingTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 25, 2009·112 cites·10 claims
- 0297US7216794B2Bond capillary design for ribbon wire bondingTEXAS INSTRUMENTS INC·Filed 2005·Granted May 15, 2007·56 cites·2 claims
- 0393US12176298B2Floating die packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 24, 2024·2 cites·27 claims
- 0493US8569082B2Semiconductor package with a mold material encapsulating a chip and a portion of a lead frameKUMMERL STEVEN A·Filed 2011·Granted Oct 29, 2013·18 cites·9 claims
- 0588US10861796B2Floating die packageTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 8, 2020·4 cites·8 claims
- 0686US9646906B2Semiconductor package with printed sensorTEXAS INSTRUMENTS INC·Filed 2015·Granted May 9, 2017·5 cites·14 claims
- 0784US7741704B2Leadframe and mold compound interlock in packaged semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2007·Granted Jun 22, 2010·12 cites·5 claims
- 0883US7847391B2Manufacturing method for integrating a shunt resistor into a semiconductor packageTEXAS INSTRUMENTS INC·Filed 2008·Granted Dec 7, 2010·11 cites·13 claims
- 0983US7821113B2Leadframe having delamination resistant die padTEXAS INSTRUMENTS INC·Filed 2008·Granted Oct 26, 2010·11 cites·9 claims
- 1082US7635613B2Semiconductor device having firmly secured heat spreaderTEXAS INSTRUMENTS INC·Filed 2005·Granted Dec 22, 2009·11 cites·4 claims
- 1181US9496171B2Printed interconnects for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 15, 2016·3 cites·18 claims
- 1279US9378882B2Method of fabricating an electronic circuitKUMMERL STEVEN·Filed 2011·Granted Jun 28, 2016·5 cites·14 claims
- 1378US11972994B2Film covers for sensor packagesTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 30, 2024·0 cites·19 claims
- 1477US8129228B2Manufacturing method for integrating a shunt resistor into a semiconductor packageUDOMPANYAVIT UBOL·Filed 2010·Granted Mar 6, 2012·5 cites·16 claims
- 1576US2025140708A1Semiconductor package with shunt and patterned metal traceTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1675US2025318318A1Integrated filter optical packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1775US2024413058A1Custom leadframe from standard plus printed leadframe portionTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1874US11270937B2Integrated inductor with magnetic mold compoundTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 8, 2022·2 cites·19 claims
- 1971US8072770B2Semiconductor package with a mold material encapsulating a chip and a portion of a lead frameKUMMERL STEVEN A·Filed 2009·Granted Dec 6, 2011·4 cites·19 claims
- 2071US2024413239A1Ldmos nanosheet transistorTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2170US12040197B2Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 16, 2024·0 cites·17 claims
- 2270US11658083B2Film covers for sensor packagesTEXAS INSTRUMENTS INC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2370US11551986B2Shape memory polymer for use in semiconductor device fabricationTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 10, 2023·0 cites·18 claims
- 2469US2023093214A1Shape memory polymer for use in semiconductor device fabricationTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2567US8053876B2Multi lead frame power packageTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 8, 2011·2 cites·7 claims
- 2666US11854947B2Integrated circuit chip with a vertical connectorTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 2764US12211800B2Semiconductor package with shunt and patterned metal traceTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 2864US7919842B2Structure and method for sealing cavity of micro-electro-mechanical deviceTEXAS INSTRUMENTS INC·Filed 2009·Granted Apr 5, 2011·2 cites·21 claims
- 2963US2025006870A1Optical filtering for semiconductor device packagingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3062US8154109B2Leadframe having delamination resistant die padSAHASRABUDHE KAPIL H·Filed 2010·Granted Apr 10, 2012·2 cites·11 claims
- 3161US7256482B2Integrated circuit chip packaging assemblyTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 14, 2007·8 cites·8 claims
- 3259US10553573B2Self-assembly of semiconductor die onto a leadframe using magnetic fieldsTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 4, 2020·0 cites·18 claims
- 3359US2025046683A1Wirebond electroplating structure for full cut wettable flank structures for son packagesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3458US12087859B2Method for improving transistor performanceTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 10, 2024·0 cites·16 claims
- 3558US2016268023A1Transfer mold compound mixture for fabricating an electronic circuitTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 3656US12080633B2Custom leadframe from standard plus printed leadframe portionTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 3, 2024·0 cites·32 claims
- 3756US7504713B2Plastic semiconductor packages having improved metal land-locking featuresTEXAS INSTRUMENTS INC·Filed 2007·Granted Mar 17, 2009·1 cites·15 claims
- 3855US10340152B1Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 2, 2019·0 cites·9 claims
- 3954US12364052B2Integrated filter optical packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 15, 2025·0 cites·34 claims
- 4054US9241405B2Interposer with extruded feed-through viasTEXAS INSTRUMENTS INC·Filed 2013·Granted Jan 19, 2016·0 cites·11 claims
- 4154US2019326131A1Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 4253US11735506B2Packages with multiple exposed padsTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 22, 2023·0 cites·30 claims
- 4353US10535594B2Interposer with extruded feed-through viasTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 14, 2020·0 cites·32 claims
- 4453US2024178085A1Open cavity integrated circuitTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4551US10804185B2Integrated circuit chip with a vertical connectorTEXAS INSTRUMENTS INC·Filed 2015·Granted Oct 13, 2020·0 cites·18 claims
- 4651US9679864B2Printed interconnects for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 13, 2017·0 cites·7 claims
- 4751US7488623B2Integrated circuit chip packaging assemblyTEXAS INSTRUMENTS INC·Filed 2007·Granted Feb 10, 2009·0 cites·4 claims
- 4851US2018323361A1Thermoelectric device embedded in a printed circuit boardTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 4951US2023207410A1Low stress laser modified mold cap packageTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 5051US2008020517A1Multi Lead Frame Power PackageTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →