Transfer mold compound mixture for fabricating an electronic circuit

Abstract

A transfer mold compound mixture for use in a transfer mold device to encapsulate electronic components. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound.

What is claimed is: 
     
         1 - 20 . (canceled) 
     
     
         21 . A transfer mold compound mixture for use in a transfer mold device to encapsulate electronic components, said transfer mold compound mixture comprising a mold compound and at least one ferromagnetic material. 
     
     
         22 . The transfer mold compound of  claim 21 , wherein said ferromagnetic material comprises at least one of sendust, permalloy, supermalloy, and molybdenum supermalloy. 
     
     
         23 . The transfer mold compound of  claim 21 , wherein the relative permeability of the mixed transfer mold compound is at least five hundred percent greater than the relative permeability of said mold compound. 
     
     
         24 . The transfer mold compound of  claim 21 , wherein the relative permeability of the mixed transfer mold compound is at least one thousand percent greater than the relative permeability of said mold compound. 
     
     
         25 . The transfer mold compound of  claim 21 , wherein said ferromagnetic material comprises at least ten percent of the weight of said mixed mold compound. 
     
     
         26 . The transfer mold compound of  claim 21 , wherein said ferromagnetic material comprises at least fifteen percent of the weight of said mixed mold compound.