Inventor · disambiguated record
Sang-Gui Jo
Also filed as: JO SANG-GUI
7 granted patents·2 pending applications·26 citations·filing 2005–2012
80Inventor score
Top patents by PatentIndex Score
9 records- 0189US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0282US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 0376US7952199B2Circuit board including solder ball land having hole and semiconductor package having the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 31, 2011·4 cites·7 claims
- 0471US8466554B2Electronic device having interconnections, openings, and pads having greater width than the openingsPARK JI-YONG·Filed 2011·Granted Jun 18, 2013·3 cites·18 claims
- 0557US7667325B2Circuit board including solder ball land having hole and semiconductor package having the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·1 cites·6 claims
- 0644US2009108447A1Semiconductor device having a fine pitch bondpadSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0741US8828795B2Method of fabricating semiconductor package having substrate with solder ball connectionsJO SANG-GUI·Filed 2012·Granted Sep 9, 2014·0 cites·8 claims
- 0837US8304892B2Semiconductor package having substrate with solder ball connections and method of fabricating the sameJO SANG-GUI·Filed 2010·Granted Nov 6, 2012·0 cites·8 claims
- 0933US2007018312A1Wiring substrate and semiconductor package implementing the sameJO SANG-GUI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →