Assignee
JO SANG-GUI
KR·2 granted patents·1 pending application·0 citations·filing 2005–2012
Top patents by PatentIndex Score
3 records- 0141US8828795B2Method of fabricating semiconductor package having substrate with solder ball connectionsJO SANG-GUI·Filed 2012·Granted Sep 9, 2014·0 cites·8 claims
- 0237US8304892B2Semiconductor package having substrate with solder ball connections and method of fabricating the sameJO SANG-GUI·Filed 2010·Granted Nov 6, 2012·0 cites·8 claims
- 0333US2007018312A1Wiring substrate and semiconductor package implementing the sameJO SANG-GUI·Filed 2005·Application pending·0 cites
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