Inventor · disambiguated record
Sang-Heui Lee
Also filed as: LEE SANG-HEUI
4 granted patents·3 pending applications·27 citations·filing 2007–2016
75Inventor score
Top patents by PatentIndex Score
7 records- 0189US9869717B2Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 16, 2018·6 cites·20 claims
- 0289US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0382US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 0473US8952510B2Semiconductor chip and film and tab package comprising the chip and filmSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 10, 2015·3 cites·21 claims
- 0550US2013127486A1Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Package Having The SameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0646US2008119061A1Semiconductor chip having bumps of different heights and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0743US2008111254A1Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern filmSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →