Inventor · disambiguated record
Po-Hung Chen
Also filed as: CHEN PO-HUNG
57 granted patents·21 pending applications·311 citations·filing 1994–2024
98Inventor score
Files withCHEN PO-HUNG14QUALCOMM INC10TAIWAN SEMICONDUCTOR MFG CO LTD8SIGURD MICROELECTRONICS CORP6RADIANT INNOVATION INC5
Top patents by PatentIndex Score
78 records- 0198US11670941B2Single-gate-oxide power inverter and electrostatic discharge protection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 6, 2023·3 cites·20 claims
- 0296US11067897B1Photoresist baking apparatus with cover plate having uneven exhaust hole distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 0395US11392039B2Photoresist baking apparatus with cover plate having uneven exhaust hole distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 19, 2022·2 cites·20 claims
- 0495US9865337B1Write data path to reduce charge leakage of negative boostQUALCOMM INC·Filed 2017·Granted Jan 9, 2018·20 cites·20 claims
- 0593US11374403B2Single-gate-oxide power inverter and electrostatic discharge protection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 28, 2022·2 cites·20 claims
- 0692US11450359B1Memory write methods and circuitsQUALCOMM INC·Filed 2021·Granted Sep 20, 2022·4 cites·21 claims
- 0788US10931103B2Single-gate-oxide power inverter and electrostatic discharge protection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 23, 2021·4 cites·20 claims
- 0886US9805815B1Electrical fuse bit cell and mask setTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·4 cites·20 claims
- 0985US7297918B1Image sensor package structure and image sensing moduleSIGURD MICROELECTRONICS CORP·Filed 2006·Granted Nov 20, 2007·24 cites·10 claims
- 1085US5347918AVacuum thermal cookerCHEN HUNG·Filed 1994·Granted Sep 20, 1994·79 cites·1 claims
- 1183US12019944B2Method for operating mirrored content under mirror mode and computer readable storage mediumHTC CORP·Filed 2022·Granted Jun 25, 2024·2 cites·11 claims
- 1283US7323675B2Packaging structure of a light-sensing device with a spacer wallSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Jan 29, 2008·12 cites·17 claims
- 1382US7282788B2Image sensing chip package structureSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Oct 16, 2007·11 cites·11 claims
- 1481US7405456B2Optical sensor chip packageSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Jul 29, 2008·11 cites·20 claims
- 1581US7118463B1Sand blasting machineCHEN PO-HUNG·Filed 2006·Granted Oct 10, 2006·10 cites·10 claims
- 1678US11740558B2Photoresist baking apparatus with cover plate having uneven exhaust hole distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 1778US7547571B2Packaging method of a light-sensing semiconductor device and packaging structure thereofSIGURD MICROELECTRONICS CORP·Filed 2008·Granted Jun 16, 2009·5 cites·4 claims
- 1877US7843747B2System and method for better testability of OTP memoryTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 30, 2010·10 cites·12 claims
- 1977US7733096B2Methods of testing fuse elements for memory devicesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 8, 2010·10 cites·20 claims
- 2076US8427857B2Electrical fuse programming time control schemeCHEN PO-HUNG·Filed 2010·Granted Apr 23, 2013·6 cites·18 claims
- 2175US7459629B2Extension box of storage mediaMACPOWER & TYTECH TECHNOLOGY C·Filed 2005·Granted Dec 2, 2008·4 cites·7 claims
- 2273US9997208B1High-speed level shifterQUALCOMM INC·Filed 2017·Granted Jun 12, 2018·3 cites·23 claims
- 2372US11600307B2Memory circuit architectureQUALCOMM INC·Filed 2020·Granted Mar 7, 2023·1 cites·41 claims
- 2471US9673773B2Signal interconnect with high pass filterQUALCOMM INC·Filed 2015·Granted Jun 6, 2017·2 cites·17 claims
- 2568US10476388B2SIMO based DC-DC converters for thermoelectric energy harvestingLEADTREND TECH CORP·Filed 2015·Granted Nov 12, 2019·2 cites·20 claims
- 2668US8919985B2Backlight module and thermal design thereofAU OPTRONICS CORP·Filed 2012·Granted Dec 30, 2014·2 cites·18 claims
- 2767US6403487B1Method of forming separated spacer structures in mixed-mode integrated circuitsUNITED MICROELECTRONICS CORP·Filed 1997·Granted Jun 11, 2002·28 cites·26 claims
- 2866US9940987B2High-speed word line decoder and level-shifterQUALCOMM INC·Filed 2016·Granted Apr 10, 2018·2 cites·19 claims
- 2966US9608602B2Uncertainty aware interconnect design to improve circuit performance and/or yieldQUALCOMM INC·Filed 2015·Granted Mar 28, 2017·2 cites·27 claims
- 3066US7358482B2Packaging structure of a light-sensing element and fabrication method thereofSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Apr 15, 2008·3 cites·5 claims
- 3166US7218628B2Method and device for detecting preamble of wireless data frameMEDIATEK INC·Filed 2002·Granted May 15, 2007·12 cites·10 claims
- 3266US6101138AArea efficient global row redundancy scheme for DRAMETRON TECHNOLOGY INC·Filed 1999·Granted Aug 8, 2000·24 cites·15 claims
- 3365US12379263B2Dual-purpose temperature measuring deviceRADIANT INNOVATION INC·Filed 2023·Granted Aug 5, 2025·0 cites·10 claims
- 3465US11783449B2Method for adjusting displayed content based on host posture, host, and computer readable storage mediumHTC CORP·Filed 2022·Granted Oct 10, 2023·0 cites·19 claims
- 3563US12474219B2Dual-purpose temperature measuring deviceRADIANT INNOVATION INC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 3662US2025364292A1Method for delivering wafer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3761US8432759B2Measuring electrical resistanceHSU KUOYUAN·Filed 2010·Granted Apr 30, 2013·2 cites·20 claims
- 3860US12367927B2Pseudo-differential de-glitch sense amplifierQUALCOMM INC·Filed 2023·Granted Jul 22, 2025·0 cites·21 claims
- 3960US11908537B2Memory circuit architectureQUALCOMM INC·Filed 2023·Granted Feb 20, 2024·0 cites·30 claims
- 4057US12348630B2Apparatus and method for detecting errors during data encryptionSILICON MOTION INC·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 4154US10325648B2Write driver scheme for bit-writable memoriesQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·1 cites·15 claims
- 4253US12338528B2Method for fabricating semiconductor device with deposition cycles of chemical vapor deposition process to form composite contact structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Jun 24, 2025·0 cites·19 claims
- 4353US8194490B2Electrical fuse memory arraysCHEN PO-HUNG·Filed 2010·Granted Jun 5, 2012·1 cites·20 claims
- 4452US11543298B1Temperature calibration method for a temperature measuring deviceRADIANT INNOVATION INC·Filed 2021·Granted Jan 3, 2023·0 cites·9 claims
- 4552US2023402388A1Semiconductor device with composite contact structureNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4651US12225126B2Apparatus and method for detecting errors during data encryptionSILICON MOTION INC·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 4751US8489814B2Cache controller, method for controlling the cache controller, and computing system comprising the sameCHEN PO-HUNG·Filed 2009·Granted Jul 16, 2013·0 cites·28 claims
- 4850US2007075236A1Packaging method of a light-sensing semiconductor device and packaging structure thereofCHEN PO-HUNG·Filed 2005·Application pending·0 cites
- 4948US8802327B2Electrode structure capable of separate delivering gas and fluid and passive fuel cell using the sameTSENG FAN GANG·Filed 2011·Granted Aug 12, 2014·0 cites·18 claims
- 5048US8646950B2Display apparatusLIN YI-FAN·Filed 2012·Granted Feb 11, 2014·0 cites·7 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Po-Hung Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →