Assignee
SIGURD MICROELECTRONICS CORP
TW·7 granted patents·3 pending applications·77 citations·filing 2005–2017
Top patents by PatentIndex Score
10 records- 0185US7297918B1Image sensor package structure and image sensing moduleSIGURD MICROELECTRONICS CORP·Filed 2006·Granted Nov 20, 2007·24 cites·10 claims
- 0283US9831197B1Wafer-level package with metal shielding structure and the manufacturing method thereofSIGURD MICROELECTRONICS CORP·Filed 2017·Granted Nov 28, 2017·11 cites·12 claims
- 0383US7323675B2Packaging structure of a light-sensing device with a spacer wallSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Jan 29, 2008·12 cites·17 claims
- 0482US7282788B2Image sensing chip package structureSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Oct 16, 2007·11 cites·11 claims
- 0581US7405456B2Optical sensor chip packageSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Jul 29, 2008·11 cites·20 claims
- 0678US7547571B2Packaging method of a light-sensing semiconductor device and packaging structure thereofSIGURD MICROELECTRONICS CORP·Filed 2008·Granted Jun 16, 2009·5 cites·4 claims
- 0766US7358482B2Packaging structure of a light-sensing element and fabrication method thereofSIGURD MICROELECTRONICS CORP·Filed 2005·Granted Apr 15, 2008·3 cites·5 claims
- 0844US2016146920A1Rf parameter calibration methodSIGURD MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 0942US2014042305A1Optical package moduleSIGURD MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1025US2016207762A1Sensor package structure and methodSIGURD MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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