Inventor · disambiguated record
Jeff Reeder
Also filed as: REEDER JEFF
3 granted patents·1 pending application·10 citations·filing 2001–2004
64Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC3
Top patents by PatentIndex Score
4 records- 0155US7384805B2Transfer mold semiconductor packaging processesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 10, 2008·5 cites·30 claims
- 0255US7148083B2Transfer mold semiconductor packaging processesMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 12, 2006·5 cites·11 claims
- 0339US7095115B2Circuit substrates, semiconductor packages, and ball grid arraysMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 22, 2006·0 cites·61 claims
- 0436US2003205828A9Circuit substrates, semiconductor packages, and ball grid arraysFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →