Inventor · disambiguated record
Roger J. Stierman
Also filed as: STIERMAN ROGER J · STIERMAN ROGER JOSEPH
11 granted patents·5 pending applications·308 citations·filing 1984–2005
92Inventor score
Top patents by PatentIndex Score
16 records- 0194US5024746AFixture and a method for plating contact bumps for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1990·Granted Jun 18, 1991·93 cites·10 claims
- 0294US4931149AFixture and a method for plating contact bumps for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1989·Granted Jun 5, 1990·74 cites·7 claims
- 0379US7132845B1FA tool using conductor modelTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 7, 2006·14 cites·5 claims
- 0478US4861452AFixture for plating tall contact bumps on integrated circuitTEXAS INSTRUMENTS INC·Filed 1987·Granted Aug 29, 1989·30 cites·12 claims
- 0574US6798212B2Time domain reflectometer probe having a built-in reference ground pointTEXAS INSTRUMENTS INC·Filed 2002·Granted Sep 28, 2004·22 cites·17 claims
- 0664US4691854ACoatings for ceramic bonding capillariesTEXAS INSTRUMENTS INC·Filed 1984·Granted Sep 8, 1987·30 cites·10 claims
- 0759US4874476AFixture for plating tall contact bumps on integrated circuitTEXAS INSTRUMENTS INC·Filed 1988·Granted Oct 17, 1989·13 cites·3 claims
- 0855US6534327B2Method for reworking metal layers on integrated circuit bond padsTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 18, 2003·6 cites·20 claims
- 0953US4979015AInsulated substrate for flip-chip integrated circuit deviceTEXAS INSTRUMENTS INC·Filed 1988·Granted Dec 18, 1990·22 cites·28 claims
- 1049US7071013B2Fixture and method for uniform electroless metal deposition on integrated circuit bond padsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 4, 2006·2 cites·11 claims
- 1147US6821791B2Method for reworking metal layers on integrated circuit bond padsTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 23, 2004·2 cites·20 claims
- 1240US2005217574A1Fixture and method for uniform electroless metal deposition on integrated circuit bond padsAMADOR GONZALO·Filed 2005·Application pending·0 cites
- 1338US2003071319A1Structure and method for bond pads of copper-metallized integrated circuitsFiled 2002·Application pending·0 cites
- 1438US2001047944A1Fixture and method for uniform electroless metal deposition on integrated circuit bond padsFiled 2001·Application pending·0 cites
- 1537US2001033020A1Structure and method for bond pads of copper-metallized integrated circuitsFiled 2001·Application pending·0 cites
- 1634US2003107137A1Micromechanical device contact terminals free of particle generationFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →