Inventor · disambiguated record
Walter R. Merry
Also filed as: MERRY WALTER · MERRY WALTER R · MERRY WALTER RICHARDSON
27 granted patents·5 pending applications·1,607 citations·filing 1995–2016
97Inventor score
Files withAPPLIED MATERIALS INC21COLLINS KENNETH S3MERRY WALTER R2APPLIED MARTERIALS INC1CHEN ZHIGANG1
Top patents by PatentIndex Score
32 records- 0198US5819434AEtch enhancement using an improved gas distribution plateAPPLIED MATERIALS INC·Filed 1996·Granted Oct 13, 1998·608 cites·18 claims
- 0297US7358192B2Method and apparatus for in-situ film stack processingAPPLIED MATERIALS INC·Filed 2004·Granted Apr 15, 2008·174 cites·31 claims
- 0396US8313664B2Efficient and accurate method for real-time prediction of the self-bias voltage of a wafer and feedback control of ESC voltage in plasma processing chamberCHEN ZHIGANG·Filed 2009·Granted Nov 20, 2012·44 cites·8 claims
- 0496US7968469B2Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformityAPPLIED MATERIALS INC·Filed 2007·Granted Jun 28, 2011·46 cites·26 claims
- 0594US5786276ASelective plasma etching of silicon nitride in presence of silicon or silicon oxides using mixture of CH3F or CH2F2 and CF4 and O2APPLIED MATERIALS INC·Filed 1997·Granted Jul 28, 1998·317 cites·18 claims
- 0690US7967996B2Process for wafer backside polymer removal and wafer front side photoresist removalAPPLIED MATERIALS INC·Filed 2007·Granted Jun 28, 2011·16 cites·20 claims
- 0790US7879731B2Improving plasma process uniformity across a wafer by apportioning power among plural VHF sourcesAPPLIED MATERIALS INC·Filed 2007·Granted Feb 1, 2011·13 cites·28 claims
- 0889US7879183B2Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2008·Granted Feb 1, 2011·13 cites·25 claims
- 0988US8076247B2Plasma process uniformity across a wafer by controlling RF phase between opposing electrodesCOLLINS KENNETH S·Filed 2007·Granted Dec 13, 2011·11 cites·20 claims
- 1086US8329593B2Method and apparatus for removing polymer from the wafer backside and edgeYOUSIF IMAD·Filed 2007·Granted Dec 11, 2012·14 cites·17 claims
- 1184US5780359APolymer removal from top surfaces and sidewalls of a semiconductor waferAPPLIED MATERIALS INC·Filed 1995·Granted Jul 14, 1998·67 cites·12 claims
- 1282US9338871B2Feedforward temperature control for plasma processing apparatusMAHADESWARASWAMY CHETAN·Filed 2010·Granted May 10, 2016·5 cites·14 claims
- 1382US8916793B2Temperature control in plasma processing apparatus using pulsed heat transfer fluid flowSILVEIRA FERNANDO M·Filed 2011·Granted Dec 23, 2014·7 cites·13 claims
- 1482US8080479B2Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonatorCOLLINS KENNETH S·Filed 2007·Granted Dec 20, 2011·6 cites·20 claims
- 1581US6015761AMicrowave-activated etching of dielectric layersAPPLIED MATERIALS INC·Filed 1996·Granted Jan 18, 2000·62 cites·37 claims
- 1680US6432830B1Semiconductor fabrication processAPPLIED MATERIALS INC·Filed 1998·Granted Aug 13, 2002·58 cites·37 claims
- 1777US7884025B2Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sourcesAPPLIED MATERIALS INC·Filed 2007·Granted Feb 8, 2011·4 cites·24 claims
- 1876US5789322ALow volume gas distribution assembly for a chemical downstream etch toolAPPLIED MATERIALS INC·Filed 1997·Granted Aug 4, 1998·26 cites·20 claims
- 1975US7554334B2Matching network characterization using variable impedance analysisAPPLIED MARTERIALS INC·Filed 2006·Granted Jun 30, 2009·7 cites·19 claims
- 2071US7056830B2Method for plasma etching a dielectric layerAPPLIED MATERIALS INC·Filed 2003·Granted Jun 6, 2006·14 cites·21 claims
- 2169US10854425B2Feedforward temperature control for plasma processing apparatusAPPLIED MATERIALS INC·Filed 2016·Granted Dec 1, 2020·1 cites·8 claims
- 2268US5728260ALow volume gas distribution assembly and method for a chemical downstream etch toolAPPLIED MATERIALS INC·Filed 1996·Granted Mar 17, 1998·18 cites·18 claims
- 2366US8632689B2Temperature control with stacked proportioning valveMERRY WALTER R·Filed 2012·Granted Jan 21, 2014·3 cites·20 claims
- 2466US6248206B1Apparatus for sidewall profile control during an etch processAPPLIED MATERIALS INC·Filed 1996·Granted Jun 19, 2001·33 cites·8 claims
- 2559US9214315B2Temperature control in plasma processing apparatus using pulsed heat transfer fluid flowAPPLIED MATERIALS INC·Filed 2014·Granted Dec 15, 2015·0 cites·7 claims
- 2657US6355557B2Oxide plasma etching process with a controlled wineglass shapeAPPLIED MATERIALS INC·Filed 1998·Granted Mar 12, 2002·27 cites·23 claims
- 2750US2014224767A1Automated algorithm for tuning of feedforward control parameters in plasma processing systemMERRY WALTER R·Filed 2014·Application pending·0 cites
- 2849US6062237APolymer removal from top surfaces and sidewalls of a semiconductor waferAPPLIED MATERIALS INC·Filed 1998·Granted May 16, 2000·13 cites·10 claims
- 2947US2009302002A1Method and apparatus for removing polymer from a substrateAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3046US2011120505A1Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 3145US2009293907A1Method of substrate polymer removalFUNG NANCY·Filed 2008·Application pending·0 cites
- 3244US2008178803A1Plasma reactor with ion distribution uniformity controller employing plural vhf sourcesCOLLINS KENNETH S·Filed 2007·Application pending·0 cites
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