Inventor · disambiguated record
Seungbae Park
Also filed as: PARK SEUNGBAE
8 granted patents·3 pending applications·188 citations·filing 1998–2021
87Inventor score
Files withIBM6ADVANCED SEMICONDUCTOR ENG2CALETKA DAVID VINCENT1JANG KYUNG WOON1WESTERN DIGITAL TECH INC1
Top patents by PatentIndex Score
11 records- 0192US6627998B1Wafer scale thin film packageIBM·Filed 2000·Granted Sep 30, 2003·58 cites·18 claims
- 0286US6288900B1Warpage compensating heat spreaderIBM·Filed 1999·Granted Sep 11, 2001·88 cites·24 claims
- 0385US11663081B2Storage system and method for data recovery after detection of an uncorrectable errorWESTERN DIGITAL TECH INC·Filed 2021·Granted May 30, 2023·2 cites·20 claims
- 0476US9891048B2Measurement equipmentADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 13, 2018·4 cites·23 claims
- 0555US10222209B2Measurement equipmentADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 5, 2019·0 cites·23 claims
- 0655US6347901B1Solder interconnect techniquesIBM·Filed 1999·Granted Feb 19, 2002·20 cites·2 claims
- 0751US2008119029A1Wafer scale thin film packageCALETKA DAVID VINCENT·Filed 2008·Application pending·0 cites
- 0850US7348261B2Wafer scale thin film packageIBM·Filed 2003·Granted Mar 25, 2008·3 cites·6 claims
- 0946US6291776B1Thermal deformation management for chip carriersIBM·Filed 1998·Granted Sep 18, 2001·13 cites·12 claims
- 1046US2008029888A1Solder Interconnect Joints For A Semiconductor PackageIBM·Filed 2006·Application pending·0 cites
- 1135US2012018084A1Printed Circuit Board Assembly Manufacturing Device And MethodJANG KYUNG WOON·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →