Inventor · disambiguated record
Keith Wells
Also filed as: WELLS KEITH · WELLS KEITH B · WELLS KEITH BUCKLEY
16 granted patents·6 pending applications·1,103 citations·filing 1993–2024
95Inventor score
Files withKLA TENCOR CORP8KLA TENCOR TECH CORP3LAM RES CORP3TENCOR INSTRUMENTS3APPLIED MATERIALS INC2
Top patents by PatentIndex Score
22 records- 0198US6081325AOptical scanning system for surface inspectionKLA TENCOR CORP·Filed 1997·Granted Jun 27, 2000·279 cites·67 claims
- 0297US5864394ASurface inspection systemKLA TENCOR CORP·Filed 1995·Granted Jan 26, 1999·335 cites·113 claims
- 0395US9915625B2Optical die to database inspectionKLA TENCOR CORP·Filed 2016·Granted Mar 13, 2018·22 cites·35 claims
- 0495US5355212AProcess for inspecting patterned wafersTENCOR INSTRUMENTS·Filed 1993·Granted Oct 11, 1994·163 cites·29 claims
- 0593US11263737B2Defect classification and source analysis for semiconductor equipmentLAM RES CORP·Filed 2019·Granted Mar 1, 2022·10 cites·40 claims
- 0693US6888627B2Optical scanning system for surface inspectionKLA TENCOR CORP·Filed 2003·Granted May 3, 2005·40 cites·163 claims
- 0790US10648924B2Generating high resolution images from low resolution images for semiconductor applicationsKLA TENCOR CORP·Filed 2017·Granted May 12, 2020·5 cites·27 claims
- 0890US7477372B2Optical scanning system for surface inspectionKLA TENCOR TECH CORP·Filed 2007·Granted Jan 13, 2009·10 cites·40 claims
- 0989US5604585AParticle detection system employing a subsystem for collecting scattered light from the particlesTENCOR INSTRUMENTS·Filed 1995·Granted Feb 18, 1997·106 cites·34 claims
- 1086US6922236B2Systems and methods for simultaneous or sequential multi-perspective specimen defect inspectionKLA TENCOR TECH CORP·Filed 2002·Granted Jul 26, 2005·36 cites·26 claims
- 1186US5530550AOptical wafer positioning systemTENCOR INSTRUMENTS·Filed 1994·Granted Jun 25, 1996·79 cites·39 claims
- 1281US7075637B2Optical scanning system for surface inspectionKLA TENCOR CORP·Filed 2003·Granted Jul 11, 2006·13 cites·51 claims
- 1378US11984330B2Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scannerLAM RES CORP·Filed 2019·Granted May 14, 2024·2 cites·26 claims
- 1476US10012599B2Optical die to database inspectionKLA TENCOR CORP·Filed 2016·Granted Jul 3, 2018·2 cites·24 claims
- 1574US9816940B2Wafer inspection with focus volumetric methodKLA TENCOR CORP·Filed 2016·Granted Nov 14, 2017·1 cites·25 claims
- 1663US2022270237A1Defect classification and source analysis for semiconductor equipmentLAM RES CORP·Filed 2022·Application pending·0 cites
- 1760US2025332662A1Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scannerPAENG DONG WOO·Filed 2024·Application pending·0 cites
- 1857US12394655B2Subsurface alignment metrology system for packaging applicationsAPPLIED MATERIALS INC·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 1956US2024248046A1Multi-head optical inspection systems and techniques for semiconductor manufacturingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2056US2006203235A1Optical Scanning System for Surface InspectionKLA TENCOR TECH CORP·Filed 2006·Application pending·0 cites
- 2154US2005110986A1Scanning system for inspecting anamolies on surfacesFiled 2004·Application pending·0 cites
- 2248US2002097393A1Scanning system for inspecting anamolies on surfacesFiled 2001·Application pending·0 cites
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