Inventor · disambiguated record
Lip Seng Tan
Also filed as: TAN LIP SENG
2 granted patents·17 citations·filing 2006–2009
60Inventor score
Technology areasH10W
Files withSTATS CHIPPAC LTD2
Top patents by PatentIndex Score
2 records- 0181US7598599B2Semiconductor package system with substrate having different bondable heights at lead finger tipsSTATS CHIPPAC LTD·Filed 2006·Granted Oct 6, 2009·10 cites·18 claims
- 0277US7986032B2Semiconductor package system with substrate having different bondable heights at lead finger tipsSTATS CHIPPAC LTD·Filed 2009·Granted Jul 26, 2011·7 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →