Inventor · disambiguated record
Hidekazu Manabe
Also filed as: MANABE HIDEKAZU
5 granted patents·2 pending applications·55 citations·filing 1996–2006
77Inventor score
Files withMITSUBISHI ELECTRIC CORP2RENESAS DEVICE DESIGN CORP2RENESAS TECH CORP2TOYOTA MOTOR CO LTD1
Top patents by PatentIndex Score
7 records- 0181US6925922B2Apparatus for removing tiebars after molding of semiconductor chipRENESAS TECH CORP·Filed 2002·Granted Aug 9, 2005·38 cites·5 claims
- 0253US6363976B1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 2, 2002·8 cites·12 claims
- 0344US2006237087A1Method of forming leads of a packaged semiconductor deviceRENESAS DEVICE DESIGN CORP·Filed 2006·Application pending·0 cites
- 0442US7077170B2Method of forming leads of a semiconductor deviceRENESAS DEVICE DESIGN CORP·Filed 2003·Granted Jul 18, 2006·2 cites·8 claims
- 0541US2005230789A1Method for removing tiebars after molding of semiconductor chipRENESAS TECH CORP·Filed 2005·Application pending·0 cites
- 0636US5950687ALead forming apparatus and lead forming methodMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 14, 1999·7 cites·12 claims
- 0731US7185425B2Method for connecting printed circuit boardsTOYOTA MOTOR CO LTD·Filed 2003·Granted Mar 6, 2007·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →