Method for removing tiebars after molding of semiconductor chip

Abstract

A method for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body attached to the lead frame, includes preparing a support member and cutters, the support member including holes engageable with the cutters, positioning the lead frame in place on the support member, moving the cutters relative to the support member so that the cutters are fitted into corresponding holes of the support member, punching out tiebars of the lead frame, and thereafter, removing any scraps left between leads of the lead frame.

1 - 4 . (canceled)  
   
   
       5 . A method for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body attached to the lead frame, comprising: 
 preparing a support member and cutters, the support member including holes engageable with the cutters;    positioning the lead frame in place on the support member;    moving the cutters relative to the support member so that the cutters are fitted into corresponding holes of the support member, punching out tiebars of the lead frame; and    thereafter, removing any scraps left between leads of the lead frame.    
   
   
       6 . The removing method in accordance with  claim 5 , wherein removing any scraps comprises: 
 preparing a second support member and projections, the second support member including holes engageable with the projections;    positioning the lead frame in place on the second support member; and    moving the projections relative to the second support member so that the projections are fitted into the corresponding holes in the second support member, pushing the scraps out of the lead frame and into the holes.    
   
   
       7 . The removing method in accordance with  claim 5 , wherein moving comprises supplying gas to the cutters of the first punch when the cutters are fitted into the corresponding holes of the support member.  
   
   
       8 . A method for manufacturing a semiconductor device, comprising: 
 encapsulating at least one semiconductor component positioned on a lead frame in a resin to form a package body;    removing remaining gates after the semiconductor component has been encapsulated; and    removing tiebars of the lead frame after the remaining gates have been removed, wherein 
 removing the tiebars comprises positioning the lead frame in place on a support member including holes;  
 moving cutters relative to the support member so that the cutters are fitted into corresponding holes of the support member, punching out the tiebars; and  
 thereafter, removing any scraps lefts between leads of the lead frame.