Inventor · disambiguated record
Hogeon Song
Also filed as: SONG HOGEON
6 granted patents·3 pending applications·28 citations·filing 2011–2024
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0192US9202716B2Methods of fabricating fan-out wafer level packages and packages formed by the methodsSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Dec 1, 2015·18 cites·20 claims
- 0276US10008488B2Semiconductor module adapted to be inserted into connector of external deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 26, 2018·3 cites·19 claims
- 0369US11257723B2Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 22, 2022·1 cites·20 claims
- 0469US8766455B2Stacked semiconductor devices and fabrication methods thereofJEONG SEYOUNG·Filed 2011·Granted Jul 1, 2014·3 cites·17 claims
- 0568US9793165B2Methods of fabricating semiconductor devicesJEONG SEYOUNG·Filed 2012·Granted Oct 17, 2017·3 cites·10 claims
- 0656US2025316640A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0749US2014312505A1Semiconductor devices and fabrication methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0838US8933561B2Semiconductor device for semiconductor package having through silicon vias of different heightsJEONG SEYOUNG·Filed 2011·Granted Jan 13, 2015·0 cites·19 claims
- 0938US2012049349A1Semiconductor chips and methods of forming the sameLEE HO-JIN·Filed 2011·Application pending·0 cites
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