Inventor · disambiguated record
Gregory B. Shinn
Also filed as: SHINN GREGORY · SHINN GREGORY B · SHINN GREGORY BOYD
17 granted patents·8 pending applications·258 citations·filing 1996–2025
93Inventor score
Top patents by PatentIndex Score
25 records- 0185US10249621B2Dummy contacts to mitigate plasma charging damage to gate dielectricsTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 2, 2019·5 cites·20 claims
- 0285US5751582AControlling process modules using site models and monitor wafer controlTEXAS INSTRUMENTS INC·Filed 1996·Granted May 12, 1998·97 cites·21 claims
- 0383US8309957B2Replacement of scribeline padframe with saw-friendly designCHATTERJEE BASAB·Filed 2010·Granted Nov 13, 2012·11 cites·12 claims
- 0483US5996594APost-chemical mechanical planarization clean-up process using post-polish scrubbingTEXAS INSTRUMENTS INC·Filed 1996·Granted Dec 7, 1999·86 cites·29 claims
- 0581US10784193B2IC with thin film resistor with metal wallsTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 22, 2020·3 cites·20 claims
- 0680US10354951B1Thin film resistor with punch-through viasTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 16, 2019·2 cites·7 claims
- 0779US2025379100A1Dielectric silicon nitride barrier deposition process for improved metal leakage and adhesionTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0875US8093070B2Method for leakage reduction in fabrication of high-density FRAM arraysCELII FRANCIS GABRIEL·Filed 2007·Granted Jan 10, 2012·8 cites·19 claims
- 0972US11848268B2Thin film resistor with punch-through viasTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 19, 2023·0 cites·6 claims
- 1072US7183187B2Integration scheme for using silicided dual work function metal gatesTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 27, 2007·16 cites·15 claims
- 1169US12406880B2Dielectric silicon nitride barrier deposition process for improved metal leakage and adhesionTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 1263US11424183B2IC with thin film resistor with metal wallsTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 1362US2025336812A1Thin film resistor integration within a copper interconnectTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1461US11101212B2Thin film resistor with punch-through viasTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 24, 2021·0 cites·5 claims
- 1555US6534327B2Method for reworking metal layers on integrated circuit bond padsTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 18, 2003·6 cites·20 claims
- 1655US2024113156A1Thin film resistor mismatch improvement using a self-aligned double pattern (sadp) techniqueTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1754US6268297B1Self-planarizing low-temperature doped-silicate-glass process capable of gap-filling narrow spacesTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 31, 2001·18 cites·15 claims
- 1849US6686283B1Shallow trench isolation planarization using self aligned isotropic etchTEXAS INSTRUMENTS INC·Filed 2000·Granted Feb 3, 2004·4 cites·34 claims
- 1949US2007181532A1Cmp clean process for high performance copper/low-k devicesTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 2047US6821791B2Method for reworking metal layers on integrated circuit bond padsTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 23, 2004·2 cites·20 claims
- 2141US2005247675A1Treatment of dies prior to nickel silicide formationTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2239US10956646B2Customizing circuit layout design rules for fabrication facilitiesTEXAS INSTRUMENTS INC·Filed 2017·Granted Mar 23, 2021·0 cites·20 claims
- 2337US2004074518A1Surfactants for post-chemical mechanical polishing storage and cleaningTEXAS INSTRUMENTS INC·Filed 2002·Application pending·0 cites
- 2437US2004074517A1Surfactants for chemical mechanical polishingTEXAS INSTRUMENTS INC·Filed 2002·Application pending·0 cites
- 2533US2002072237A1Method for unpatterned resist etch back of shallow trench isolation refill insulatorFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →