Inventor · disambiguated record
Thomas Houghton
Also filed as: HOUGHTON THOMAS · HOUGHTON THOMAS F · HOUGHTON THOMAS FRANCIS
18 granted patents·5 pending applications·220 citations·filing 1986–2024
92Inventor score
Top patents by PatentIndex Score
23 records- 0197US11650381B1PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical componentsGLOBALFOUNDRIES US INC·Filed 2022·Granted May 16, 2023·10 cites·20 claims
- 0297US10816726B1Edge couplers for photonics applicationsGLOBALFOUNDRIES INC·Filed 2019·Granted Oct 27, 2020·43 cites·20 claims
- 0395US12130470B2PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical componentsGLOBALFOUNDRIES US INC·Filed 2021·Granted Oct 29, 2024·3 cites·17 claims
- 0493US11487059B2Photonics integrated circuit with silicon nitride waveguide edge couplerGLOBALFOUNDRIES US INC·Filed 2021·Granted Nov 1, 2022·3 cites·20 claims
- 0590US11860414B2Edge couplers including a grooved membraneGLOBALFOUNDRIES US INC·Filed 2020·Granted Jan 2, 2024·2 cites·19 claims
- 0686US6009153AElectronic devices and programming methods thereforLUCENT TECHNOLOGIES INC·Filed 1997·Granted Dec 28, 1999·106 cites·23 claims
- 0782US11828983B2Photonics chips including cavities with non-right-angle internal cornersGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 28, 2023·1 cites·20 claims
- 0877US2024402421A1Pic die and package with multiple level and multiple depth connections of fibers to on-chip optical componentsGLOBALFOUNDRIES US INC·Filed 2024·Application pending·0 cites
- 0971US9589895B2Whole wafer edge sealIBM·Filed 2015·Granted Mar 7, 2017·2 cites·7 claims
- 1070US11810870B2Moisture seal for photonic devicesGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 1170US8613996B2Polymeric edge seal for bonded substratesFAROOQ MUKTA G·Filed 2009·Granted Dec 24, 2013·3 cites·17 claims
- 1268US4721689AMethod for simultaneously forming an interconnection level and via studsIBM·Filed 1986·Granted Jan 26, 1988·45 cites·15 claims
- 1364US12487408B2Reference markers adjacent to a cavity in a photonics chipGLOBALFOUNDRIES US INC·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 1462US12449615B2Calibration markers for a photonics chipGLOBALFOUNDRIES US INC·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 1562US7910484B2Method for preventing backside defects in dielectric layers formed on semiconductor substratesIBM·Filed 2008·Granted Mar 22, 2011·1 cites·12 claims
- 1661US7179760B2Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making sameIBM·Filed 2005·Granted Feb 20, 2007·1 cites·15 claims
- 1757US11587888B2Moisture seal for photonic devicesGLOBALFOUNDRIES US INC·Filed 2019·Granted Feb 21, 2023·0 cites·18 claims
- 1855US2025164707A1Structures for a photonics chip that enable external communicationGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1952US12461312B2Cladding structure in the back end of line of photonics chipsGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 4, 2025·0 cites·17 claims
- 2051US2025306274A1Structures including a photonic device and an undercutGLOBALFOUNDRIES US INC·Filed 2024·Application pending·0 cites
- 2147US8894800B2Polymeric edge seal for bonded substratesIBM·Filed 2013·Granted Nov 25, 2014·0 cites·20 claims
- 2242US2021278611A1Methods of forming a v-groove for a fiber optics cable on an integrated photonics chipGLOBALFOUNDRIES US INC·Filed 2020·Application pending·0 cites
- 2337US2004137745A1Method and apparatus for removing backside edge polymerIBM·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →