Inventor · disambiguated record
Boh Kid Wong
Also filed as: WONG BOH KID
4 granted patents·9 citations·filing 2012–2014
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0175US8927345B2Device package with rigid interconnect structure connecting die and substrate and method thereofYAP WENG FOONG·Filed 2012·Granted Jan 6, 2015·6 cites·19 claims
- 0261US8680660B1Brace for bond wireLAW LAI CHENG·Filed 2013·Granted Mar 25, 2014·3 cites·20 claims
- 0339US8741666B1Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wiresYAP WENG F·Filed 2013·Granted Jun 3, 2014·0 cites·20 claims
- 0435US9337167B2Wire bonding method employing two scrub settingsWONG BOH KID·Filed 2014·Granted May 10, 2016·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Boh Kid Wong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →