Assignee
YAP WENG FOONG
US·4 granted patents·1 pending application·14 citations·filing 2012–2013
Top patents by PatentIndex Score
5 records- 0182US9123685B2Microelectronic packages having frontside thermal contacts and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Granted Sep 1, 2015·6 cites·20 claims
- 0275US8927345B2Device package with rigid interconnect structure connecting die and substrate and method thereofYAP WENG FOONG·Filed 2012·Granted Jan 6, 2015·6 cites·19 claims
- 0361US9018045B2Microelectronic packages and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Granted Apr 28, 2015·1 cites·20 claims
- 0460US8927417B2Semiconductor package signal routing using conductive viasYAP WENG FOONG·Filed 2012·Granted Jan 6, 2015·1 cites·13 claims
- 0542US2015076700A1System-in-packages containing embedded surface mount devices and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Application pending·0 cites
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