Inventor · disambiguated record
Geun Sik Kim
Also filed as: KIM GEUN S · KIM GEUN-SIK
7 granted patents·2 pending applications·83 citations·filing 2001–2013
84Inventor score
Top patents by PatentIndex Score
9 records- 0192US7671451B2Semiconductor package having double layer leadframeCHIPPAC INC·Filed 2005·Granted Mar 2, 2010·41 cites·9 claims
- 0289US8405230B2Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereofLEE JAE SOO·Filed 2011·Granted Mar 26, 2013·11 cites·21 claims
- 0389US7880313B2Semiconductor flip chip package having substantially non-collapsible spacerCHIPPAC INC·Filed 2005·Granted Feb 1, 2011·17 cites·6 claims
- 0467US7615851B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Nov 10, 2009·3 cites·4 claims
- 0560US6427291B1BuckleFiled 2001·Granted Aug 6, 2002·11 cites·1 claims
- 0652US8410587B2Integrated circuit package systemLEE TAESUNG·Filed 2009·Granted Apr 2, 2013·0 cites·19 claims
- 0747US7785925B2Integrated circuit packaging system with package stacking and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 31, 2010·0 cites·20 claims
- 0844US2015013048A1Belt buckleKIM GEUN-SIK·Filed 2013·Application pending·0 cites
- 0937US2005224959A1Die with discrete spacers and die spacing methodCHIPPAC INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →