Inventor · disambiguated record
Dao Nguyen Phu Cuong
Also filed as: CUONG DAO NGUYEN PHU
9 granted patents·43 citations·filing 2014–2016
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0192US9331003B1Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2014·Granted May 3, 2016·15 cites·19 claims
- 0291US9406531B1Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2014·Granted Aug 2, 2016·11 cites·9 claims
- 0383US9355983B1Integrated circuit packaging system with interposer structure and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2014·Granted May 31, 2016·5 cites·15 claims
- 0478US9412624B1Integrated circuit packaging system with substrate and method of manufacture thereofCUONG DAO NGUYEN PHU·Filed 2014·Granted Aug 9, 2016·6 cites·20 claims
- 0576US9502267B1Integrated circuit packaging system with support structure and method of manufacture thereofCHI HEEJO·Filed 2014·Granted Nov 22, 2016·4 cites·20 claims
- 0666US9679769B1Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 13, 2017·1 cites·20 claims
- 0762US9406642B1Integrated circuit packaging system with insulated trace and method of manufacture thereofCHI HEEJO·Filed 2015·Granted Aug 2, 2016·1 cites·17 claims
- 0851US9659897B1Integrated circuit packaging system with interposer structure and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted May 23, 2017·0 cites·14 claims
- 0949US10109587B1Integrated circuit packaging system with substrate and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Oct 23, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →