Inventor · disambiguated record
Yu Jin
Also filed as: JIN YU · Jin yu-feng
12 granted patents·3 pending applications·26 citations·filing 2010–2025
86Inventor score
Files withAPPLIED MATERIALS INC5J METRICS TECH CO LTD5GUO WEI2BOE TECHNOLOGY GROUP CO LTD1NANJING TZONE BIOTECHNOLOGY CO LTD1
Top patents by PatentIndex Score
15 records- 0190US11075072B2Wafer scale ultrasonic sensing device and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2020·Granted Jul 27, 2021·3 cites·11 claims
- 0285US8409906B2Non-vacuum method for fabrication of a photovoltaic absorber layerGUO WEI·Filed 2010·Granted Apr 2, 2013·7 cites·23 claims
- 0382US11460341B2Wafer scale ultrasonic sensor assembly and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2019·Granted Oct 4, 2022·3 cites·20 claims
- 0476US9580801B2Enhancing electrical property and UV compatibility of ultrathin blok barrier filmAPPLIED MATERIALS INC·Filed 2014·Granted Feb 28, 2017·3 cites·19 claims
- 0576US8748216B2Non-vacuum method for fabrication of a photovoltaic absorber layerGUO WEI·Filed 2011·Granted Jun 10, 2014·4 cites·9 claims
- 0675US8852962B2Apparatus and methods for silicon oxide CVD resist planarizationAPPLIED MATERIALS INC·Filed 2012·Granted Oct 7, 2014·3 cites·20 claims
- 0773US9633861B2Cu/barrier interface enhancementAPPLIED MATERIALS INC·Filed 2014·Granted Apr 25, 2017·3 cites·8 claims
- 0865US2023014827A1Wafer level ultrasonic chip module having suspension structureJ METRICS TECH CO LTD·Filed 2022·Application pending·0 cites
- 0954US10657349B2Ultrasonic module and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2018·Granted May 19, 2020·0 cites·16 claims
- 1053US12473350B2Recombinant humanized type III collagen microsphere with innovative spatial structure, and design, preparation process and usethereofNANJING TZONE BIOTECHNOLOGY CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·12 claims
- 1151US11478822B2Wafer level ultrasonic chip module having suspension structure and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·7 claims
- 1251US2025327185A1Fail-safe control in substrate processing systemsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1343US2016013049A1Enhancing uv compatibility of low k barrier filmAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1436US11590536B2Wafer level ultrasonic chip module and manufacturing method thereofSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2019·Granted Feb 28, 2023·0 cites·7 claims
- 1536US10692746B2Substrate lift bar and method for smearing anti-static liquidBOE TECHNOLOGY GROUP CO LTD·Filed 2017·Granted Jun 23, 2020·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →