Inventor · disambiguated record
Feng Q. Liu
Also filed as: LIU FENG · LIU FENG Q · LIU FENG QUAN
91 granted patents·62 pending applications·1,137 citations·filing 2000–2025
99Inventor score
Top patents by PatentIndex Score
153 records- 0198US9460959B1Methods for pre-cleaning conductive interconnect structuresAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·113 cites·18 claims
- 0298US6776693B2Method and apparatus for face-up substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·101 cites·46 claims
- 0396US7422516B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 9, 2008·42 cites·18 claims
- 0496US7278911B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Oct 9, 2007·33 cites·18 claims
- 0596US6899804B2Electrolyte composition and treatment for electrolytic chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·77 cites·37 claims
- 0695US6962524B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 8, 2005·80 cites·32 claims
- 0795US6423811B1Low dielectric constant materials with polymeric networksHONEYWELL INT INC·Filed 2000·Granted Jul 23, 2002·52 cites·21 claims
- 0893US6979248B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 27, 2005·42 cites·61 claims
- 0992US6863797B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2002·Granted Mar 8, 2005·45 cites·41 claims
- 1092US6713590B2Low dielectric constant materials with polymeric networksHONEYWELL INT INC·Filed 2001·Granted Mar 30, 2004·34 cites·19 claims
- 1191US11760768B2Molybdenum(0) precursors for deposition of molybdenum filmsAPPLIED MATERIALS INC·Filed 2021·Granted Sep 19, 2023·2 cites·1 claims
- 1291US7390744B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jun 24, 2008·17 cites·14 claims
- 1391US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 1491US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 1591US6416685B1Chemical mechanical planarization of low dielectric constant materialsHONEYWELL INT INC·Filed 2000·Granted Jul 9, 2002·74 cites·4 claims
- 1690US11398388B2Methods for selective dry etching gallium oxideAPPLIED MATERIALS INC·Filed 2020·Granted Jul 26, 2022·2 cites·13 claims
- 1790US11124874B2Methods for depositing metallic iridium and iridium silicideAPPLIED MATERIALS INC·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 1888US7207878B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·11 cites·19 claims
- 1987US11946135B2Low temperature deposition of iridium containing filmsAPPLIED MATERIALS INC·Filed 2023·Granted Apr 2, 2024·0 cites·14 claims
- 2087US10043709B2Methods for thermally forming a selective cobalt layerAPPLIED MATERIALS INC·Filed 2015·Granted Aug 7, 2018·5 cites·19 claims
- 2187US9914995B2Alcohol assisted ALD film depositionAPPLIED MATERIALS INC·Filed 2015·Granted Mar 13, 2018·4 cites·20 claims
- 2287US7084064B2Full sequence metal and barrier layer electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 1, 2006·14 cites·29 claims
- 2387US6509415B1Low dielectric constant organic dielectrics based on cage-like structuresHONEYWELL INT INC·Filed 2000·Granted Jan 21, 2003·26 cites·16 claims
- 2487US2024200188A1Low temperature deposition of iridium containing filmsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2586US7229535B2Hydrogen bubble reduction on the cathode using double-cell designsAPPLIED MATERIALS INC·Filed 2003·Granted Jun 12, 2007·25 cites·20 claims
- 2682US12415824B2Molybdenum(0) precursors for deposition of molybdenum filmsAPPLIED MATERIALS INC·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 2782US7210988B2Method and apparatus for reduced wear polishing pad conditioningAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·9 cites·35 claims
- 2881US7160432B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jan 9, 2007·21 cites·34 claims
- 2981US7104869B2Barrier removal at low polish pressureAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·26 cites·24 claims
- 3081US6469123B1Compositions and methods for thermosetting molecules in organic compositionsHONEYWELL INT INC·Filed 2000·Granted Oct 22, 2002·17 cites·14 claims
- 3180US6821881B2Method for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·17 cites·6 claims
- 3280US6803441B2Compositions and methods for thermosetting molecules in organic compositionsHONEYWELL INT INC·Filed 2002·Granted Oct 12, 2004·13 cites·19 claims
- 3379US7344431B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·5 cites·21 claims
- 3478US12281387B2Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 22, 2025·0 cites·5 claims
- 3578US7128825B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·20 cites·29 claims
- 3678US7077721B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2003·Granted Jul 18, 2006·17 cites·31 claims
- 3778US2025250675A1Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3876US11894233B2Electronic device having an oxygen free platinum group metal filmAPPLIED MATERIALS INC·Filed 2022·Granted Feb 6, 2024·0 cites·9 claims
- 3976US11643721B2Low temperature deposition of iridium containing filmsAPPLIED MATERIALS INC·Filed 2018·Granted May 9, 2023·0 cites·10 claims
- 4076US9916975B2Precursors of manganese and manganese-based compounds for copper diffusion barrier layers and methods of useAPPLIED MATERIALS INC·Filed 2015·Granted Mar 13, 2018·2 cites·20 claims
- 4176US7307137B2Low dielectric constant materials and methods of preparation thereofHONEYWELL INT INC·Filed 2001·Granted Dec 11, 2007·7 cites·50 claims
- 4275US6797777B2Low dielectric constant organic dielectrics based on cage-like structuresHONEYWELL INT INC·Filed 2001·Granted Sep 28, 2004·12 cites·13 claims
- 4374US12281382B2Methods for depositing blocking layers on conductive surfacesAPPLIED MATERIALS INC·Filed 2023·Granted Apr 22, 2025·0 cites·5 claims
- 4473US7232514B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jun 19, 2007·15 cites·63 claims
- 4572US6991526B2Control of removal profile in electrochemically assisted CMPAPPLIED MATERIALS INC·Filed 2002·Granted Jan 31, 2006·14 cites·14 claims
- 4672US6736992B2Chemical mechanical planarization of low dielectric constant materialsHONEYWELL INT INC·Filed 2002·Granted May 18, 2004·14 cites·12 claims
- 4771US7384534B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2005·Granted Jun 10, 2008·2 cites·16 claims
- 4871US7374644B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted May 20, 2008·13 cites·58 claims
- 4970US7608173B2Biased retaining ringAPPLIED MATERIALS INC·Filed 2004·Granted Oct 27, 2009·12 cites·23 claims
- 5070US6849696B2Low dielectric constant organic dielectrics based on cage-like structuresHONEYWELL INT INC·Filed 2002·Granted Feb 1, 2005·7 cites·15 claims
Showing the top 50 of 153 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →