Inventor · disambiguated record
Hiroyuki Iwami
Also filed as: IWAMI HIROYUKI
5 granted patents·2 pending applications·241 citations·filing 1978–2014
83Inventor score
Files withIWAMI HIROYUKI2MIDORI ELECTRONICS CO LTD1OSAKA CITY & TAIYO MANUFACTURI1TAIYO KOSAKUSHO KK1YOTSUTSUJI AKIRA1
Top patents by PatentIndex Score
7 records- 0187US4225109AInsulated metal moldOSAKA CITY & TAIYO MANUFACTURI·Filed 1978·Granted Sep 30, 1980·68 cites·5 claims
- 0280US5468141AMold for injection molding of thermoplastic resinTAIYO KOSAKUSHO KK·Filed 1994·Granted Nov 21, 1995·58 cites·13 claims
- 0379US4285901AMethod of making an insulated metal moldYOTSUTSUJI AKIRA·Filed 1979·Granted Aug 25, 1981·43 cites·17 claims
- 0478US5159671AData transfer unit for small computer system with simultaneous transfer to two memories and error detection and rewrite to substitute addressMIDORI ELECTRONICS CO LTD·Filed 1988·Granted Oct 27, 1992·72 cites·1 claims
- 0542US8865042B2Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity moldIWAMI HIROYUKI·Filed 2007·Granted Oct 21, 2014·0 cites·12 claims
- 0642US2015075701A1Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity moldIWAMI HIROYUKI·Filed 2014·Application pending·0 cites
- 0735US2003031836A1Adhesive tapeFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →