Assignee
IWAMI HIROYUKI
JP·1 granted patent·1 pending application·0 citations·filing 2007–2014
Top patents by PatentIndex Score
2 records- 0142US8865042B2Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity moldIWAMI HIROYUKI·Filed 2007·Granted Oct 21, 2014·0 cites·12 claims
- 0242US2015075701A1Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity moldIWAMI HIROYUKI·Filed 2014·Application pending·0 cites
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