Inventor · disambiguated record
Deokkyung Yang
Also filed as: YANG DEOKKYUNG
50 granted patents·2 pending applications·264 citations·filing 2008–2025
98Inventor score
Top patents by PatentIndex Score
52 records- 0197US10797024B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 6, 2020·6 cites·25 claims
- 0297US10636765B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Apr 28, 2020·24 cites·21 claims
- 0397US8063475B2Semiconductor package system with through silicon via interposerCHOI DAESIK·Filed 2008·Granted Nov 22, 2011·56 cites·18 claims
- 0495US10388637B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·8 cites·24 claims
- 0594US10937741B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Mar 2, 2021·10 cites·25 claims
- 0693US11189598B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2019·Granted Nov 30, 2021·7 cites·25 claims
- 0793US10468384B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 5, 2019·7 cites·24 claims
- 0891US10797039B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 6, 2020·6 cites·21 claims
- 0991US9171739B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofROH YOUNGDAL·Filed 2014·Granted Oct 27, 2015·20 cites·20 claims
- 1090US11670618B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 6, 2023·2 cites·25 claims
- 1190US10700011B2Semiconductor device and method of forming an integrated SIP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 30, 2020·7 cites·22 claims
- 1289US10636774B2Semiconductor device and method of forming a 3D integrated system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Apr 28, 2020·5 cites·23 claims
- 1389US8765525B2Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposerYOON IN SANG·Filed 2011·Granted Jul 1, 2014·8 cites·9 claims
- 1488US9997468B2Integrated circuit packaging system with shielding and method of manufacturing thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 12, 2018·5 cites·20 claims
- 1587US8067306B2Integrated circuit packaging system with exposed conductor and method of manufacture thereofYANG DEOKKYUNG·Filed 2010·Granted Nov 29, 2011·11 cites·20 claims
- 1685US10636756B2Semiconductor device and method of forming protrusion E-bar for 3D SIPSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 28, 2020·4 cites·25 claims
- 1785US9202715B2Integrated circuit packaging system with connection structure and method of manufacture thereofKIM YOUNGCHUL·Filed 2011·Granted Dec 1, 2015·9 cites·10 claims
- 1882US9385066B1Integrated circuit packaging system with molded laser via interposer and method of manufacture thereofYOON IN SANG·Filed 2014·Granted Jul 5, 2016·4 cites·10 claims
- 1981US12046564B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2081US8633100B2Method of manufacturing integrated circuit packaging system with support structureYANG DEOKKYUNG·Filed 2011·Granted Jan 21, 2014·6 cites·18 claims
- 2181US8497575B2Semiconductor packaging system with an aligned interconnect and method of manufacture thereofYOON IN SANG·Filed 2010·Granted Jul 30, 2013·6 cites·20 claims
- 2279US12266614B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·25 claims
- 2379US8518752B2Integrated circuit packaging system with stackable package and method of manufacture thereofYANG DEOKKYUNG·Filed 2009·Granted Aug 27, 2013·8 cites·20 claims
- 2479US2025201730A1Molded Laser Package with Electromagnetic Interference Shield and Method of MakingSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2578US9905491B1Interposer substrate designs for semiconductor packagesYOON IN SANG·Filed 2013·Granted Feb 27, 2018·5 cites·6 claims
- 2677US8546957B2Integrated circuit packaging system with dielectric support and method of manufacture thereofKO WONJUN·Filed 2010·Granted Oct 1, 2013·5 cites·20 claims
- 2776US11676911B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·22 claims
- 2876US7859099B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Dec 28, 2010·6 cites·20 claims
- 2974US8247894B2Integrated circuit package system with step mold recessYOON IN SANG·Filed 2008·Granted Aug 21, 2012·6 cites·20 claims
- 3073US11652088B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2021·Granted May 16, 2023·0 cites·24 claims
- 3173US9184067B1Methods of mitigating defects for semiconductor packagesKIM KYUNGHWAN·Filed 2013·Granted Nov 10, 2015·4 cites·20 claims
- 3272US11587882B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 21, 2023·0 cites·17 claims
- 3371US9748203B2Integrated circuit packaging system with conductive pillars and method of manufacture thereofYANG DEOKKYUNG·Filed 2011·Granted Aug 29, 2017·3 cites·10 claims
- 3470US9230898B2Integrated circuit packaging system with package-on-package and method of manufacture thereofSHIN HANGIL·Filed 2009·Granted Jan 5, 2016·4 cites·18 claims
- 3568US10083903B1Integrated circuit packaging system with molded laser via interposer and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Sep 25, 2018·1 cites·20 claims
- 3665US11842991B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2020·Granted Dec 12, 2023·0 cites·21 claims
- 3765US11367690B2Semiconductor device and method of forming an integrated SiP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 21, 2022·0 cites·23 claims
- 3865US10790268B2Semiconductor device and method of forming a 3D integrated system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 29, 2020·0 cites·25 claims
- 3965US8102666B2Integrated circuit package systemPARK HYUNGSANG·Filed 2008·Granted Jan 24, 2012·3 cites·10 claims
- 4063US11244908B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2018·Granted Feb 8, 2022·0 cites·25 claims
- 4163US8823160B2Integrated circuit package system having cavityHA JONG-WOO·Filed 2008·Granted Sep 2, 2014·2 cites·20 claims
- 4262US8603859B2Integrated circuit packaging system with dual side mold and method of manufacture thereofYANG DEOKKYUNG·Filed 2011·Granted Dec 10, 2013·1 cites·20 claims
- 4360US11342294B2Semiconductor device and method of forming protrusion e-bar for 3D SiPSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 24, 2022·0 cites·22 claims
- 4460US7994625B2Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 9, 2011·2 cites·20 claims
- 4559US8699232B2Integrated circuit packaging system with interposer and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Apr 15, 2014·1 cites·9 claims
- 4658US11145603B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 12, 2021·0 cites·16 claims
- 4758US11024585B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 4858US7687920B2Integrated circuit package-on-package system with central bond wiresSTATS CHIPPAC LTD·Filed 2008·Granted Mar 30, 2010·1 cites·22 claims
- 4957US8592973B2Integrated circuit packaging system with package-on-package stacking and method of manufacture thereofPARK HYUNGSANG·Filed 2009·Granted Nov 26, 2013·1 cites·20 claims
- 5048US7875967B2Integrated circuit with step molded inner stacking module package in package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jan 25, 2011·0 cites·20 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →