Inventor · disambiguated record
Takeshi Tsuno
Also filed as: TSUNO TAKESHI
8 granted patents·8 pending applications·16 citations·filing 2005–2014
80Inventor score
Files withTSUNO TAKESHI5KINOUCHI MASATO4MITSUBISHI HEAVY IND LTD3MITSUBISHI HEAVY IND MACHINE TOOL CO LTD2FUJI XEROX CO LTD1
Top patents by PatentIndex Score
16 records- 0178US9443711B2Room-temperature bonding apparatusKINOUCHI MASATO·Filed 2012·Granted Sep 13, 2016·5 cites·6 claims
- 0276US9130000B2Wafer bonding device and wafer bonding methodTSUNO TAKESHI·Filed 2009·Granted Sep 8, 2015·6 cites·8 claims
- 0363US8906175B2Room temperature bonding apparatusKINOUCHI MASATO·Filed 2009·Granted Dec 9, 2014·2 cites·11 claims
- 0460US9064910B2Bonding unit control unit and multi-layer bonding methodKINOUCHI MASATO·Filed 2010·Granted Jun 23, 2015·1 cites·7 claims
- 0560US8857487B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2008·Granted Oct 14, 2014·1 cites·13 claims
- 0658US8985175B2Room temperature bonding machine and room temperature bonding methodKINOUCHI MASATO·Filed 2008·Granted Mar 24, 2015·1 cites·4 claims
- 0748US2007256774A1Method of manufacturing microstructure and manufacturing system for the sameTSUNO TAKESHI·Filed 2007·Application pending·0 cites
- 0847US2005233064A1Method of manufacturing microstructure and manufacturing system for the sameFUJI XEROX CO LTD·Filed 2005·Application pending·0 cites
- 0946US9005390B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 1045US2017162428A1Room-temperature bonding apparatusMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2014·Application pending·0 cites
- 1144US2005229737A1Manufacturing system for microstructureMITSUBISHI HEAVY IND LTD·Filed 2005·Application pending·0 cites
- 1243US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 1341US2015249026A1Room-temperature bonding apparatus and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 1438US2015294900A1Room-temperature bonded device, wafer having room-temperature bonded device, and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 1535US2013112334A1Room temperature bonding apparatus and room temperature bonding methodTSUNO TAKESHI·Filed 2011·Application pending·0 cites
- 1632US2012247645A1Bonding method, bonding apparatus, and bonding systemTSUTSUMI KEIICHIRO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →