Inventor · disambiguated record
Masato Kinouchi
Also filed as: KINOUCHI MASATO
11 granted patents·8 pending applications·24 citations·filing 2005–2015
85Inventor score
Files withMITSUBISHI HEAVY IND LTD6TSUNO TAKESHI5KINOUCHI MASATO4MITSUBISHI HEAVY IND MACHINE TOOL CO LTD2FUJI XEROX CO LTD1
Top patents by PatentIndex Score
19 records- 0187US10792759B2Laser processing method and laser processing apparatusMITSUBISHI HEAVY IND LTD·Filed 2015·Granted Oct 6, 2020·3 cites·7 claims
- 0282US9862055B2Processing apparatus and processing methodMITSUBISHI HEAVY IND LTD·Filed 2013·Granted Jan 9, 2018·5 cites·8 claims
- 0378US9443711B2Room-temperature bonding apparatusKINOUCHI MASATO·Filed 2012·Granted Sep 13, 2016·5 cites·6 claims
- 0476US9130000B2Wafer bonding device and wafer bonding methodTSUNO TAKESHI·Filed 2009·Granted Sep 8, 2015·6 cites·8 claims
- 0563US8906175B2Room temperature bonding apparatusKINOUCHI MASATO·Filed 2009·Granted Dec 9, 2014·2 cites·11 claims
- 0660US9064910B2Bonding unit control unit and multi-layer bonding methodKINOUCHI MASATO·Filed 2010·Granted Jun 23, 2015·1 cites·7 claims
- 0760US8857487B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2008·Granted Oct 14, 2014·1 cites·13 claims
- 0858US8985175B2Room temperature bonding machine and room temperature bonding methodKINOUCHI MASATO·Filed 2008·Granted Mar 24, 2015·1 cites·4 claims
- 0948US2007256774A1Method of manufacturing microstructure and manufacturing system for the sameTSUNO TAKESHI·Filed 2007·Application pending·0 cites
- 1047US2005233064A1Method of manufacturing microstructure and manufacturing system for the sameFUJI XEROX CO LTD·Filed 2005·Application pending·0 cites
- 1146US11548097B2Machining device, machining unit, and machining methodMITSUBISHI HEAVY IND LTD·Filed 2013·Granted Jan 10, 2023·0 cites·17 claims
- 1246US9005390B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 1345US2017162428A1Room-temperature bonding apparatusMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2014·Application pending·0 cites
- 1444US2005229737A1Manufacturing system for microstructureMITSUBISHI HEAVY IND LTD·Filed 2005·Application pending·0 cites
- 1543US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 1641US2015249026A1Room-temperature bonding apparatus and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 1738US2015294900A1Room-temperature bonded device, wafer having room-temperature bonded device, and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 1835US2013112334A1Room temperature bonding apparatus and room temperature bonding methodTSUNO TAKESHI·Filed 2011·Application pending·0 cites
- 1932US2012247645A1Bonding method, bonding apparatus, and bonding systemTSUTSUMI KEIICHIRO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →