Inventor · disambiguated record
Seiji Takahara
Also filed as: TAKAHARA SEIJI
3 granted patents·3 pending applications·69 citations·filing 1992–2005
71Inventor score
Top patents by PatentIndex Score
6 records- 0190US6908960B2Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettinTDK CORP·Filed 2000·Granted Jun 21, 2005·58 cites·32 claims
- 0249US2005130447A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 0349US2005130446A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 0449US2005154110A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 0535US5425011ASemiconductor integrated circuit incorporating photo detectorsKYOEI SANGYO CO LTD·Filed 1993·Granted Jun 13, 1995·8 cites·13 claims
- 0626US5276349ASemiconductor integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jan 4, 1994·3 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Seiji Takahara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →