Inventor · disambiguated record
Eric A. Sanjuan
Also filed as: SANJUAN ERIC · SANJUAN ERIC A
11 granted patents·5 pending applications·9 citations·filing 2007–2024
82Inventor score
Files withROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG8FUJIFILM DIMATIX INC3SANJUAN ERIC A3CAHILL SEAN S1REMEC BROADBAND WIRELESS NETWORKS LLC1
Top patents by PatentIndex Score
16 records- 0173US8839508B2Method of making a high frequency device packageSANJUAN ERIC A·Filed 2011·Granted Sep 23, 2014·3 cites·7 claims
- 0273US8581113B2Low cost high frequency device package and methodsSANJUAN ERIC A·Filed 2007·Granted Nov 12, 2013·5 cites·11 claims
- 0367US2025332831A1Dry film membrane tentingFUJIFILM DIMATIX INC·Filed 2024·Application pending·0 cites
- 0462US2024424791A1Process for an ipc coatingFUJIFILM DIMATIX INC·Filed 2023·Application pending·0 cites
- 0561US9859188B2Heat isolation structures for high bandwidth interconnectsROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jan 2, 2018·1 cites·16 claims
- 0655US9997489B2Coated bond wires for die packages and methods of manufacturing said coated bond wiresROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jun 12, 2018·0 cites·8 claims
- 0751US2024424788A1Ipc coating for printheadFUJIFILM DIMATIX INC·Filed 2023·Application pending·0 cites
- 0850US9275961B2Low cost high frequency device package and methodsSANJUAN ERIC A·Filed 2012·Granted Mar 1, 2016·0 cites·14 claims
- 0948US9812420B2Die packaging with fully or partially fused dielectric leadsROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Nov 7, 2017·0 cites·18 claims
- 1047US9673137B2Electronic device having a lead with selectively modified electrical propertiesROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jun 6, 2017·0 cites·15 claims
- 1147US2017271296A1Coated bond wires for die packages and methods of manufacturing said coated bond wiresROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2017·Application pending·0 cites
- 1246US10340209B2Mixed impedance leads for die packages and method of making the sameROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jul 2, 2019·0 cites·16 claims
- 1346US9824997B2Die package with low electromagnetic interference interconnectionROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Nov 21, 2017·0 cites·17 claims
- 1446US2018248242A1Metalized molded plastic components for millimeter wave electronics and method for manufactureREMEC BROADBAND WIRELESS NETWORKS LLC·Filed 2018·Application pending·0 cites
- 1545US9960468B2Metalized molded plastic components for millimeter wave electronics and method for manufactureCAHILL SEAN S·Filed 2012·Granted May 1, 2018·0 cites·15 claims
- 1645US9711479B2Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the sameROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2014·Granted Jul 18, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →