Coated bond wires for die packages and methods of manufacturing said coated bond wires

Abstract

A method of manufacturing a bond wire having a metal core, a dielectric layer, and a ground connectable metallization, wherein the bond wire has one or more vapor barrier coatings, and manufacturing a die package with at least one bond wire according to the invention.

1 . A method of manufacturing the die package including a die having a plurality of connection pads; a die substrate supporting a plurality of connection elements; and one or more leads connected between the die and the die substrate, said one or more leads having a metal core, a dielectric layer at least partially surrounding the metal core, the dielectric in turn being at least partially surrounded by a ground connectable metal coating, wherein that the lead further has at least one vapor barrier coating for protecting areas that are not covered by metal, said method including the following steps:
 using wirebonding to provide an interconnection between a metal core of a lead to both die and substrate connection pads;   coating the metal core with a dielectric;   metallization; and   deposition of at least one vapor barrier.   
     
     
         2 . The method of  claim 1 , further comprising applying an additional coating to promote adhesion to mold compounds. 
     
     
         3 . The method of  claim 1 , further comprising overmolding, curing, and/or singulating the die. 
     
     
         4 . The method of  claim 1 , further comprising removing at least part of the dielectric to expose ground pads, followed by metallization to connect the metallized layer to the ground pad. 
     
     
         5 . The method of  claim 1 , further comprising removing at least part of the metal layer and/or of an additional metal layer, followed by the deposition of an additional dielectric layer and/or of the at least one vapor barrier. 
     
     
         6 . The method of  claim 2 , further comprising removing at least part of the dielectric to expose ground pads, followed by metallization to connect the metallized layer to the ground pad. 
     
     
         7 . The method of  claim 6 , further comprising removing at least part of the metal layer and/or of an additional metal layer, followed by the deposition of an additional dielectric layer and/or of the at least one vapor barrier.