Inventor · disambiguated record
Choonghwan Kwon
Also filed as: KWON CHOONGHWAN
1 granted patent·2 pending applications·3 citations·filing 2007–2011
21Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0166US9318403B2Integrated circuit packaging system with magnetic film and method of manufacture thereofKIM SUNG SOO·Filed 2011·Granted Apr 19, 2016·3 cites·19 claims
- 0240US2010237500A1Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead SiteSTATS CHIPPAC LTD·Filed 2009·Application pending·0 cites
- 0338US2008315374A1Integrated circuit package-in-package system with magnetic filmKIM SUNG SOO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →