Inventor · disambiguated record
William T. Chen
Also filed as: CHEN WILLIAM T · CHEN WILLIAM TZE-YOU
31 granted patents·6 pending applications·987 citations·filing 1988–2019
98Inventor score
Files withIBM16ADVANCED SEMICONDUCTOR ENG12AGENCY SCIENCE TECH & RES4APPELT BERND KARL1INST MATERIALS RESEARCH & ENG1
Top patents by PatentIndex Score
37 records- 0198US6358627B2Rolling ball connectorIBM·Filed 2001·Granted Mar 19, 2002·164 cites·7 claims
- 0297US10276382B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 30, 2019·27 cites·46 claims
- 0393US6177729B1Rolling ball connectorIBM·Filed 1999·Granted Jan 23, 2001·84 cites·23 claims
- 0492US10535521B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 14, 2020·6 cites·47 claims
- 0592US7199438B2Overmolded optical packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 3, 2007·61 cites·7 claims
- 0691US10886263B2Stacked semiconductor package assemblies including double sided redistribution layersADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 5, 2021·9 cites·20 claims
- 0791US6214642B1Area array stud bump flip chip device and assembly processINST MATERIALS RESEARCH & ENG·Filed 1998·Granted Apr 10, 2001·133 cites·13 claims
- 0890US10515806B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 24, 2019·5 cites·47 claims
- 0984US8399776B2Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and packageAPPELT BERND KARL·Filed 2009·Granted Mar 19, 2013·16 cites·40 claims
- 1082US6258627B1Underfill preform interposer for joining chip to substrateIBM·Filed 1999·Granted Jul 10, 2001·69 cites·50 claims
- 1181US6864168B2Bump and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 8, 2005·25 cites·9 claims
- 1280US6819002B2Under-ball-metallurgy layerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 16, 2004·28 cites·19 claims
- 1377US6429530B1Miniaturized chip scale ball grid array semiconductor packageIBM·Filed 1998·Granted Aug 6, 2002·50 cites·16 claims
- 1476US10916429B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 9, 2021·1 cites·48 claims
- 1575US6013355ATesting laminates with x-ray moire interferometryIBM·Filed 1996·Granted Jan 11, 2000·52 cites·8 claims
- 1675US4906803AFlexible supporting cable for an electronic device and method of making sameIBM·Filed 1988·Granted Mar 6, 1990·39 cites·6 claims
- 1774US7026012B2Method and apparatus for forming a metallic feature on a substrateAGENCY SCIENCE TECH & RES·Filed 2002·Granted Apr 11, 2006·11 cites·63 claims
- 1871US6863936B2Method of forming selective electroless plating on polymer surfacesAGENCY SCIENCE TECH & RES·Filed 2001·Granted Mar 8, 2005·14 cites·21 claims
- 1968US5442144AMultilayered circuit boardIBM·Filed 1994·Granted Aug 15, 1995·25 cites·7 claims
- 2067US6403882B1Protective cover plate for flip chip assembly backsideIBM·Filed 1997·Granted Jun 11, 2002·34 cites·24 claims
- 2166US5359767AMethod of making multilayered circuit boardIBM·Filed 1993·Granted Nov 1, 1994·24 cites·13 claims
- 2261US5959348AConstruction of PBGA substrate for flip chip packingIBM·Filed 1997·Granted Sep 28, 1999·25 cites·5 claims
- 2359US6829149B1Placement of sacrificial solder balls underneath the PBGA substrateIBM·Filed 1997·Granted Dec 7, 2004·17 cites·4 claims
- 2455US6891274B2Under-bump-metallurgy layer for improving adhesionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted May 10, 2005·6 cites·25 claims
- 2554US7227268B2Placement of sacrificial solder balls underneath the PBGA substrateIBM·Filed 2004·Granted Jun 5, 2007·3 cites·16 claims
- 2652US2019088506A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 2750US2006134338A1Method and apparatus for forming a metallic feature on a substrateAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 2849US2007166866A1Overmolded optical packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2948US6353182B1Proper choice of the encapsulant volumetric CTE for different PGBA substratesIBM·Filed 1998·Granted Mar 5, 2002·14 cites·10 claims
- 3047US5773132AProtecting copper dielectric interface from delaminationIBM·Filed 1997·Granted Jun 30, 1998·13 cites·21 claims
- 3146US6255599B1Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delaminationIBM·Filed 1997·Granted Jul 3, 2001·12 cites·20 claims
- 3246US5709336AMethod of forming a solderless electrical connection with a wirebond chipIBM·Filed 1996·Granted Jan 20, 1998·13 cites·7 claims
- 3345US2016218021A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
- 3445US2005200014A1Bump and fabricating process thereofFiled 2005·Application pending·0 cites
- 3543US6838806B2Vibratory in-plane tunneling gyroscopeAGENCY SCIENCE TECH & RES·Filed 2002·Granted Jan 4, 2005·6 cites·41 claims
- 3640US2004065949A1[solder bump]Filed 2003·Application pending·0 cites
- 3731US5758979APrinter cartridge ribbon inking systemFiled 1996·Granted Jun 2, 1998·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →