Inventor · disambiguated record
Ming-Hong Tseng
Also filed as: TSENG MING-HONG
4 granted patents·1 pending application·105 citations·filing 2008–2013
79Inventor score
Top patents by PatentIndex Score
5 records- 0193US7932608B2Through-silicon via formed with a post passivation interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Apr 26, 2011·52 cites·20 claims
- 0290US8390125B2Through-silicon via formed with a post passivation interconnect structureTSENG MING-HONG·Filed 2011·Granted Mar 5, 2013·39 cites·11 claims
- 0377US8097953B2Three-dimensional integrated circuit stacking-joint interface structureTSENG MING-HONG·Filed 2008·Granted Jan 17, 2012·8 cites·20 claims
- 0476US8624360B2Cooling channels in 3DIC stacksCHING KAI-MING·Filed 2009·Granted Jan 7, 2014·6 cites·17 claims
- 0537US2014268490A1Super Capacitor And Method For Manufacturing The SameUNIV NAT TAIWAN·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →