Assignee
TSENG MING-HONG
TW·2 granted patents·47 citations·filing 2008–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0190US8390125B2Through-silicon via formed with a post passivation interconnect structureTSENG MING-HONG·Filed 2011·Granted Mar 5, 2013·39 cites·11 claims
- 0277US8097953B2Three-dimensional integrated circuit stacking-joint interface structureTSENG MING-HONG·Filed 2008·Granted Jan 17, 2012·8 cites·20 claims
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