Inventor · disambiguated record
Hirofumi Imai
Also filed as: IMAI HIROFUMI
41 granted patents·23 pending applications·258 citations·filing 1992–2024
96Inventor score
Files withTOKYO OHKA KOGYO CO LTD26NIPPON STEEL & SUMITOMO METAL CORP8IMAI HIROFUMI7ASAI TAKAHIRO6ASAHI GROUP HOLDINGS LTD3
Top patents by PatentIndex Score
64 records- 0198US5369661ASemiconductor laser-pumped solid state laser system and optical coupling system coupling semiconductor laser with optical fiberNIPPON STEEL CORP·Filed 1992·Granted Nov 29, 1994·161 cites·21 claims
- 0296US7079566B2Semiconductor laser apparatus capable of routing laser beams emitted from stacked-array laser diode to optical fiber with little lossNIPPON STEEL CORP·Filed 2005·Granted Jul 18, 2006·43 cites·23 claims
- 0391US9308715B2Laminate and method for separating the sameTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Apr 12, 2016·10 cites·3 claims
- 0485US10130564B2Dental polymerizable monomersMITSUI CHEMICALS INC·Filed 2015·Granted Nov 20, 2018·3 cites·9 claims
- 0585US10130563B2Dental polymerizable monomer compositionsMITSUI CHEMICALS INC·Filed 2015·Granted Nov 20, 2018·3 cites·12 claims
- 0684US8298365B2Sticking method and sticking apparatusIMAI HIROFUMI·Filed 2010·Granted Oct 30, 2012·7 cites·11 claims
- 0783US8794215B2Method of producing common rail and common railHIRANO KOJI·Filed 2010·Granted Aug 5, 2014·3 cites·12 claims
- 0880US9881829B2Adhesive composition, laminate, and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2017·Granted Jan 30, 2018·2 cites·18 claims
- 0976US8357750B2Adhesive composition and film adhesiveTOKYO OHKA KOGYO CO LTD·Filed 2010·Granted Jan 22, 2013·1 cites·4 claims
- 1074US9172202B2Laser apparatus and laser materials processing apparatus provided with sameIMAI HIROFUMI·Filed 2010·Granted Oct 27, 2015·3 cites·10 claims
- 1172US9415465B2Laser processing apparatus and laser processing methodNIPPON STEEL & SUMMITOMO METLA CORP·Filed 2012·Granted Aug 16, 2016·3 cites·28 claims
- 1270US10131018B2Grain-oriented magnetic steel sheet and method of producing the sameNIPPON STEEL & SUMITOMO METAL CORP·Filed 2013·Granted Nov 20, 2018·2 cites·5 claims
- 1370US8901234B2Adhesive compositionASAI TAKAHIRO·Filed 2009·Granted Dec 2, 2014·0 cites·10 claims
- 1469US7230968B2Semiconductor laser device and solid-state laser device using sameNIPPON STEEL CORP·Filed 2004·Granted Jun 12, 2007·12 cites·235 claims
- 1568US10875275B2Composition for forming separation layer, support base provided with separation layer, laminate and method of producing same, and method of producing electronic componentTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·8 claims
- 1668US9607875B2Adhesive composition, laminate, and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Mar 28, 2017·1 cites·10 claims
- 1766US11498156B2Laser processing apparatusNIPPON STEEL & SUMITOMO METAL CORP·Filed 2014·Granted Nov 15, 2022·1 cites·17 claims
- 1866US9017932B2Processed substrate and method for manufacturing sameTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Apr 28, 2015·1 cites·19 claims
- 1966US2009234087A1Adhesive composition and adhesive filmTOKYO OHKA KOGYO CO LTD·Filed 2009·Application pending·0 cites
- 2063US9115297B2Adhesive compositionIMAI HIROFUMI·Filed 2011·Granted Aug 25, 2015·1 cites·10 claims
- 2163US8809457B2Adhesive composition, adhesive film, and method for treating substrateTOKYO OHKA KOGYO CO LTD·Filed 2012·Granted Aug 19, 2014·0 cites·17 claims
- 2263US8088448B2Heat treatment methodASAI TAKAHIRO·Filed 2010·Granted Jan 3, 2012·0 cites·3 claims
- 2361US2023041025A1Negative-working photosensitive resin composition, photosensitive resist film, pattern formation method, cured film, cured film production method, and rolled bodyTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
- 2460US2024045330A1Negative photosensitive composition and pattern formation methodTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 2559US8877884B2Adhesive composition, film adhesive, and method for producing the adhesive compositionTAKAHASHI MOTOKI·Filed 2009·Granted Nov 4, 2014·0 cites·1 claims
- 2658US2011065858A1Adhesive composition and adhesive filmTOKYO OHKA KOGYO CO LTD·Filed 2010·Application pending·0 cites
- 2757US9682532B2Laminated body and method for separating laminated bodyKUBO ATSUSHI·Filed 2011·Granted Jun 20, 2017·1 cites·4 claims
- 2856US10793756B2Adhesive composition, adhesive film, and bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·9 claims
- 2956US2024103368A1Negative photosensitive composition and method for producing hollow structureTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 3055US2010159191A1Processed substrate and method for manufacturing sameIMAI HIROFUMI·Filed 2009·Application pending·0 cites
- 3154US12422747B2Negative photosensitive resin composition, pattern formation method, and laminated filmSAN APRO LTD·Filed 2021·Granted Sep 23, 2025·0 cites·10 claims
- 3254US2024327191A1Remaining amount detection apparatus and carbon dioxide gas supply apparatusASAHI GROUP HOLDINGS LTD·Filed 2024·Application pending·0 cites
- 3354US2019091979A1Laminate production method, substrate processing method, and laminateTOKYO OHKA KOGYO CO LTD·Filed 2018·Application pending·0 cites
- 3454US2024327193A1Carbon dioxide gas supply apparatusASAHI GROUP HOLDINGS LTD·Filed 2024·Application pending·0 cites
- 3553US9607744B2Laser processing apparatus and laser irradiation methodNIPPON STEEL & SUMITOMO METAL CORP·Filed 2013·Granted Mar 28, 2017·0 cites·20 claims
- 3652US2008182919A1Dental Restorative CompositionSUN MEDICAL CO LTD·Filed 2006·Application pending·0 cites
- 3751US10773338B2Laser processing apparatusNIPPON STEEL & SUMITOMO METAL CORP·Filed 2014·Granted Sep 15, 2020·0 cites·12 claims
- 3851US8980997B2Adhesive compositionTAMURA KOKI·Filed 2011·Granted Mar 17, 2015·0 cites·4 claims
- 3951US8901235B2Adhesive composition, film adhesive, and heat treatment methodASAI TAKAHIRO·Filed 2010·Granted Dec 2, 2014·0 cites·11 claims
- 4051US2025170800A1Production method for hollow structure, laminateTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 4151US2015059976A1Adhesive composition, adhesive film, and bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2013·Application pending·0 cites
- 4250US8124685B2Adhesive composition and film adhesiveIMAI HIROFUMI·Filed 2010·Granted Feb 28, 2012·0 cites·3 claims
- 4350US2024036467A1Method for producing hollow package and method for providing photosensitive compositionTOKYO OHKA KOGYO CO LTD·Filed 2021·Application pending·0 cites
- 4449US9682541B2Bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Jun 20, 2017·0 cites·8 claims
- 4549US2010086799A1Removal method, adhesive agent for substrate, and laminate including substrateASAI TAKAHIRO·Filed 2009·Application pending·0 cites
- 4649US2010186895A1Adhesive composition, film adhesive, and heat treatment methodASAI TAKAHIRO·Filed 2010·Application pending·0 cites
- 4748US10919755B2Beverage discharge cock, valve rod, and beverage dispenserASAHI GROUP HOLDINGS LTD·Filed 2019·Granted Feb 16, 2021·0 cites·23 claims
- 4848US10385418B2Grain-oriented electrical steel sheetNIPPON STEEL & SUMITOMO METAL CORP·Filed 2016·Granted Aug 20, 2019·0 cites·4 claims
- 4947US2010068453A1Method for producing processed glass substrateIMAI HIROFUMI·Filed 2009·Application pending·0 cites
- 5047US2020201181A1Negative-tone photosensitive resin composition, photosensitive resist film, and method of forming patternTOKYO OHKA KOGYO CO LTD·Filed 2019·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →