Adhesive composition, adhesive film, and bonding method

Abstract

An adhesive composition including a block copolymer. An adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×10 5 Pa or less at 220° C., and a loss factor (tan σ) of 1.3 or less at 220° C.

What is claimed is: 
     
         1 . An adhesive composition, comprising:
 a block copolymer,   wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×10 5  Pa or less at 220° C., and a loss factor (tan σ) of 1.3 or less at 220° C.   
     
     
         2 . The adhesive composition according to  claim 1 ,
 wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof.   
     
     
         3 . The adhesive composition according to  claim 2 ,
 wherein the block copolymer includes a styrene group.   
     
     
         4 . The adhesive composition according to  claim 3 ,
 wherein both terminals of a main chain of the block copolymer are styrene groups.   
     
     
         5 . The adhesive composition according to  claim 3 ,
 wherein a styrene group content of the block copolymer is in a range of 10% by weight to 65% by weight.   
     
     
         6 . The adhesive composition according to  claim 1 ,
 wherein a weight average molecular weight of the block copolymer is in a range of 50,000 to 150,000.   
     
     
         7 . The adhesive composition according to  claim 1 ,
 wherein the block copolymer is a hydrogenated product.   
     
     
         8 . The adhesive composition according to  claim 1 ,
 wherein the block copolymer includes a unit of which a glass transition temperature is 23° C. or lower.   
     
     
         9 . The adhesive composition according to  claim 1  which is used for adhering a wafer and a support. 
     
     
         10 . The adhesive composition according to  claim 9 ,
 wherein the wafer is a wafer which is subjected to a thinning process after adhered to the support.   
     
     
         11 . The adhesive composition according to  claim 9 ,
 wherein the wafer is a wafer which is exposed in an environment of 220° C. or higher after adhered to the support.   
     
     
         12 . The adhesive composition according to  claims 1 ,
 wherein a content of the block copolymer with respect to a polymer included in the adhesive composition is 15% by weight or greater.   
     
     
         13 . An adhesive film comprising:
 a film; and   an adhesive layer provided on the film, wherein the adhesive layer contains the adhesive composition according to  claim 1 .   
     
     
         14 . A bonding method, comprising:
 bonding a support to a wafer by using the adhesive composition according to  claim 1 .   
     
     
         15 . The adhesive composition according to  claim 4 ,
 wherein a styrene group content of the block copolymer is in a range of 10% by weight to 65% by weight.   
     
     
         16 . The adhesive composition according to  claim 3 , wherein the block copolymer is a hydrogenated product. 
     
     
         17 . The adhesive composition according to  claim 4 , wherein the block copolymer is a hydrogenated product. 
     
     
         18 . The adhesive composition according to  claim 5 , wherein the block copolymer is a hydrogenated product. 
     
     
         19 . The adhesive composition according to  claim 6 , wherein the block copolymer is a hydrogenated product.