Inventor · disambiguated record
Philip H. Bowles
Also filed as: BOWLES PHILIP · BOWLES PHILIP H · BOWLES PHILIP HARBAUGH
29 granted patents·5 pending applications·469 citations·filing 1994–2016
97Inventor score
Files withBOWLES PHILIP H14FREESCALE SEMICONDUCTOR INC10DELCO ELECTRONICS CORP3DELPHI TECH INC2HOOPER STEPHEN R2
Top patents by PatentIndex Score
34 records- 0199US10053359B2Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 21, 2018·35 cites·18 claims
- 0298US9499397B2Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereofBOWLES PHILIP H·Filed 2014·Granted Nov 22, 2016·49 cites·20 claims
- 0396US9108841B1Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereofBOWLES PHILIP H·Filed 2014·Granted Aug 18, 2015·23 cites·20 claims
- 0495US7446017B2Methods and apparatus for RF shielding in vertically-integrated semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·46 cites·6 claims
- 0595US6631551B1Method of forming integral passive electrical components on organic circuit board substratesDELPHI TECH INC·Filed 1998·Granted Oct 14, 2003·101 cites·20 claims
- 0694US9165886B2Sensor packaging method and sensor packagesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 20, 2015·15 cites·16 claims
- 0791US8659167B1Sensor packaging method and sensor packagesBOWLES PHILIP H·Filed 2012·Granted Feb 25, 2014·11 cites·20 claims
- 0881US9018029B1Vent hole sealing in multiple die sensor deviceBOWLES PHILIP H·Filed 2013·Granted Apr 28, 2015·4 cites·20 claims
- 0981US8686550B2Method and apparatus for high pressure sensor deviceMCDONALD WILLIAM G·Filed 2012·Granted Apr 1, 2014·9 cites·8 claims
- 1081US5594770AMethod and apparatus for imaging obscured areas of a test objectTHERMOSPECTRA CORP·Filed 1994·Granted Jan 14, 1997·53 cites·60 claims
- 1179US8709868B2Sensor packages and method of packaging dies of differing sizesBOWLES PHILIP H·Filed 2012·Granted Apr 29, 2014·4 cites·18 claims
- 1278US9365414B2Sensor package having stacked dieBOWLES PHILIP H·Filed 2014·Granted Jun 14, 2016·4 cites·20 claims
- 1378US9090454B2Sequential wafer bondingBOWLES PHILIP H·Filed 2013·Granted Jul 28, 2015·2 cites·15 claims
- 1478US8906747B2Cavity-type semiconductor package and method of packaging sameHOOPER STEPHEN R·Filed 2012·Granted Dec 9, 2014·4 cites·11 claims
- 1576US9376310B2Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 28, 2016·2 cites·20 claims
- 1675US6233817B1Method of forming thick-film hybrid circuit on a metal circuit boardDELPHI TECH INC·Filed 1999·Granted May 22, 2001·50 cites·19 claims
- 1774US9040355B2Sensor package and method of forming sameBOWLES PHILIP H·Filed 2012·Granted May 26, 2015·3 cites·15 claims
- 1873US7723224B2Microelectronic assembly with back side metallization and method for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 25, 2010·7 cites·12 claims
- 1971US9227838B2Cavity-type semiconductor package and method of packaging sameFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 5, 2016·2 cites·14 claims
- 2062US9676611B2Sensor device packages and related fabrication methodsHOOPER STEPHEN R·Filed 2013·Granted Jun 13, 2017·1 cites·18 claims
- 2157US5982631AX-ray detectable encapsulation material and method for its useDELCO ELECTRONICS CORP·Filed 1999·Granted Nov 9, 1999·18 cites·13 claims
- 2253US9604844B2Sequential wafer bondingBOWLES PHILIP H·Filed 2015·Granted Mar 28, 2017·0 cites·19 claims
- 2353US2015048462A1Sensor package and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2014·Application pending·0 cites
- 2452US2014183729A1Sensor packages having semiconductor dies of differing sizesBOWLES PHILIP H·Filed 2014·Application pending·0 cites
- 2551US6180164B1Method of forming ruthenium-based thick-film resistorsDELCO ELECTRONICS CORP·Filed 1998·Granted Jan 30, 2001·15 cites·20 claims
- 2649US10442685B2Microelectronic packages having hermetic cavities and methods for the production thereofBOWLES PHILIP H·Filed 2014·Granted Oct 15, 2019·0 cites·8 claims
- 2749US8884413B2Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufactureBOWLES PHILIP H·Filed 2012·Granted Nov 11, 2014·0 cites·17 claims
- 2849US2008246126A1Stacked and shielded die packages with interconnectsFREESCALE SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 2948US9891244B2Microelectronic packages having split gyroscope structures and methods for the fabrication thereofBOWLES PHILIP H·Filed 2014·Granted Feb 13, 2018·0 cites·19 claims
- 3047US2011250721A1Stacked and shielded packages with interconnectsFREESCALE SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 3146US5891754AMethod of inspecting integrated circuit solder joints with x-ray detectable encapsulantDELCO ELECTRONICS CORP·Filed 1997·Granted Apr 6, 1999·11 cites·7 claims
- 3241US2014048946A1Sensor packages and method of packaging dies of various sizesBOWLES PHILIP H·Filed 2012·Application pending·0 cites
- 3339US9359192B1Microelectromechanical systems (MEMS) devices with control circuits and methods of fabricationFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
- 3436US8962389B2Microelectronic packages including patterned die attach material and methods for the fabrication thereofSTERMER JR WILLIAM C·Filed 2013·Granted Feb 24, 2015·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →