Individual holder
BOWLES PHILIP H
US·12 granted patents·2 pending applications·100 citations·filing 2012–2015
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
14 records- 0198US9499397B2Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereofBOWLES PHILIP H·Filed 2014·Granted Nov 22, 2016·49 cites·20 claims
- 0296US9108841B1Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereofBOWLES PHILIP H·Filed 2014·Granted Aug 18, 2015·23 cites·20 claims
- 0391US8659167B1Sensor packaging method and sensor packagesBOWLES PHILIP H·Filed 2012·Granted Feb 25, 2014·11 cites·20 claims
- 0481US9018029B1Vent hole sealing in multiple die sensor deviceBOWLES PHILIP H·Filed 2013·Granted Apr 28, 2015·4 cites·20 claims
- 0579US8709868B2Sensor packages and method of packaging dies of differing sizesBOWLES PHILIP H·Filed 2012·Granted Apr 29, 2014·4 cites·18 claims
- 0678US9365414B2Sensor package having stacked dieBOWLES PHILIP H·Filed 2014·Granted Jun 14, 2016·4 cites·20 claims
- 0778US9090454B2Sequential wafer bondingBOWLES PHILIP H·Filed 2013·Granted Jul 28, 2015·2 cites·15 claims
- 0874US9040355B2Sensor package and method of forming sameBOWLES PHILIP H·Filed 2012·Granted May 26, 2015·3 cites·15 claims
- 0953US9604844B2Sequential wafer bondingBOWLES PHILIP H·Filed 2015·Granted Mar 28, 2017·0 cites·19 claims
- 1052US2014183729A1Sensor packages having semiconductor dies of differing sizesBOWLES PHILIP H·Filed 2014·Application pending·0 cites
- 1149US10442685B2Microelectronic packages having hermetic cavities and methods for the production thereofBOWLES PHILIP H·Filed 2014·Granted Oct 15, 2019·0 cites·8 claims
- 1249US8884413B2Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufactureBOWLES PHILIP H·Filed 2012·Granted Nov 11, 2014·0 cites·17 claims
- 1348US9891244B2Microelectronic packages having split gyroscope structures and methods for the fabrication thereofBOWLES PHILIP H·Filed 2014·Granted Feb 13, 2018·0 cites·19 claims
- 1441US2014048946A1Sensor packages and method of packaging dies of various sizesBOWLES PHILIP H·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →