Inventor · disambiguated record
Swain Hong Yeo
Also filed as: YEO SWAIN H A · YEO SWAIN HONG · YEO SWAIN HONG ALFRED
4 granted patents·6 pending applications·26 citations·filing 2002–2024
70Inventor score
Top patents by PatentIndex Score
10 records- 0183US7994608B2Magnetically alignable integrated circuit deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 9, 2011·17 cites·25 claims
- 0278US8357565B2Integrated circuit package and a method for forming an integrated circuit packageINFINENON TECHNOLOGIES AG·Filed 2010·Granted Jan 22, 2013·9 cites·21 claims
- 0360US2025336790A1Semiconductor Device and Method of Making a Wafer-Level SubstrateSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0460US2025316659A1Semiconductor Devices and Methods of Making Semiconductor Devices Having Embedded Photonic Bridge DieSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0560US2025329624A1Semiconductor Device and Method of Forming Encapsulated Interconnect Structure for Embedded Photonic Bridge DieSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0659US2025273552A1Semiconductor Device and Method of Forming Encapsulated Vertical Interconnect StructureSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0752US10861828B2Molded semiconductor package having a package-in-package structure and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 8, 2020·0 cites·18 claims
- 0847US10418343B2Package-in-package structure for semiconductor devices and methods of manufactureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 17, 2019·0 cites·12 claims
- 0941US2008122053A1Integrated Circuit Package and a Method for Forming an Integrated Circuit PackageOFNER GERALD·Filed 2008·Application pending·0 cites
- 1034US2006115927A1Attachment of flip chips to substratesINFINEON TECHNOLOGIES AG·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →