Inventor · disambiguated record
Fu-Yang Chen
Also filed as: CHEN FU-YANG
10 granted patents·2 pending applications·20 citations·filing 2018–2022
82Inventor score
Top patents by PatentIndex Score
12 records- 0195US10888001B2Circuit carrier board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 5, 2021·14 cites·12 claims
- 0286US10123418B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Nov 6, 2018·5 cites·20 claims
- 0370US10700049B2Light-emitting diode package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 30, 2020·1 cites·9 claims
- 0466US2021282277A1Manufacturing method of circuit carrier boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0562US10886264B2Manufacturing method of light-emitting diode package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jan 5, 2021·0 cites·10 claims
- 0660US11678441B2Manufacturing method of circuit carrier board structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jun 13, 2023·0 cites·7 claims
- 0760US11032917B2Circuit carrier board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 8, 2021·0 cites·11 claims
- 0860US10950687B2Manufacturing method of substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 16, 2021·0 cites·11 claims
- 0955US10700161B2Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 30, 2020·0 cites·9 claims
- 1051US12494459B2Light emitting device having a encapsulation layer covering a circuit structure and manufacturing method thereofAUO CORP·Filed 2022·Granted Dec 9, 2025·0 cites·16 claims
- 1147US2023064560A1Light emitting diode package structure, manufacturing method of light emitting diode package structure and light emitting panelAUO CORP·Filed 2022·Application pending·0 cites
- 1245US11037869B2Package structure and preparation method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 15, 2021·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →