Inventor · disambiguated record
Masahito Ishii
Also filed as: ISHII MASAHITO
4 granted patents·3 pending applications·156 citations·filing 1989–2022
74Inventor score
Top patents by PatentIndex Score
7 records- 0196US5019944AMounting substrate and its production method, and printed wiring board having connector function and its connection methodMITSUI MINING & SMELTING CO·Filed 1989·Granted May 28, 1991·139 cites·15 claims
- 0272US11515436B2Photovoltaic device and photovoltaic unitSHARP KK·Filed 2022·Granted Nov 29, 2022·0 cites·6 claims
- 0370US7178233B2Process for producing a collapsed filled via holeSUZUKI CO LTD·Filed 2003·Granted Feb 20, 2007·17 cites·8 claims
- 0448US2019189811A1Photovoltaic device and photovoltaic unitSHARP KK·Filed 2017·Application pending·0 cites
- 0543US2009314525A1Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole FormationMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0635US6798048B22-Metal layer TAB tape and both-sided CSP•BGA tapeMITSUI MINING & SMELTING CO·Filed 2001·Granted Sep 28, 2004·0 cites·14 claims
- 0730US2004099441A1Printed circuit board,its manufacturing method and csp manufacturing methodFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →