Inventor · disambiguated record
Mohan Kirloskar
Also filed as: KIRLOSKAR MOHAN · KIRLOSKAR MOHAN ARVIND
19 granted patents·2 pending applications·1,372 citations·filing 1999–2023
97Inventor score
Files withASAT LTD16SHINKO ELECTRIC IND CO2LSI LOGIC CORP1MCLELLAN NEIL1MICROSOFT TECHNOLOGY LICENSING LLC1
Top patents by PatentIndex Score
21 records- 0197US7348663B1Integrated circuit package and method for fabricating sameASAT LTD·Filed 2005·Granted Mar 25, 2008·135 cites·9 claims
- 0297US7344920B1Integrated circuit package and method for fabricating sameASAT LTD·Filed 2007·Granted Mar 18, 2008·89 cites·9 claims
- 0397US7009286B1Thin leadless plastic chip carrierASAT LTD·Filed 2004·Granted Mar 7, 2006·117 cites·11 claims
- 0497US6933176B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Aug 23, 2005·121 cites·23 claims
- 0596US7342305B1Thermally enhanced cavity-down integrated circuit packageASAT LTD·Filed 2005·Granted Mar 11, 2008·64 cites·9 claims
- 0696US6987032B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Jan 17, 2006·126 cites·29 claims
- 0795US7081403B1Thin leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jul 25, 2006·28 cites·14 claims
- 0894US7371610B1Process for fabricating an integrated circuit package with reduced mold warpingASAT LTD·Filed 2004·Granted May 13, 2008·79 cites·26 claims
- 0994US7315080B1Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreaderASAT LTD·Filed 2004·Granted Jan 1, 2008·76 cites·5 claims
- 1094US7091581B1Integrated circuit package and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 15, 2006·122 cites·9 claims
- 1193US7411289B1Integrated circuit package with partially exposed contact pads and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 12, 2008·101 cites·14 claims
- 1292US7071545B1Shielded integrated circuit packageASAT LTD·Filed 2002·Granted Jul 4, 2006·106 cites·7 claims
- 1392US6984785B1Thermally enhanced cavity-down integrated circuit packageASAT LTD·Filed 2003·Granted Jan 10, 2006·75 cites·9 claims
- 1490US7381588B1Shielded integrated circuit packageASAT LTD·Filed 2004·Granted Jun 3, 2008·74 cites·8 claims
- 1572US6777971B2High speed wafer sort and final testLSI LOGIC CORP·Filed 2003·Granted Aug 17, 2004·21 cites·17 claims
- 1665US7732914B1Cavity-type integrated circuit packageMCLELLAN NEIL·Filed 2004·Granted Jun 8, 2010·14 cites·4 claims
- 1759US2025174518A1Thermal isolation for hardware component packageMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 1858US7033517B1Method of fabricating a leadless plastic chip carrierASAT LTD·Filed 2003·Granted Apr 25, 2006·8 cites·16 claims
- 1950US2006223229A1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2006·Application pending·0 cites
- 2049US6221749B1Semiconductor device and production thereofSHINKO ELECTRIC IND CO·Filed 1999·Granted Apr 24, 2001·15 cites·20 claims
- 2131US6429517B1Semiconductor device and fabrication method thereofSHINKO ELECTRIC IND CO·Filed 1999·Granted Aug 6, 2002·1 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →